| Allicdata Part #: | ATS-16F-49-C1-R0-ND |
| Manufacturer Part#: |
ATS-16F-49-C1-R0 |
| Price: | $ 3.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16F-49-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.87721 |
| 30 +: | $ 2.79909 |
| 50 +: | $ 2.64361 |
| 100 +: | $ 2.48812 |
| 250 +: | $ 2.33264 |
| 500 +: | $ 2.25488 |
| 1000 +: | $ 2.02162 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.32°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management technologies have come a long way since the early days of convective and conductive cooling. Modern thermal management solutions solve many of the power management challenges encountered in many applications and require advanced thermal solutions to meet them. The ATS-16F-49-C1-R0 is a heat sink product line designed specifically for high-power applications with thermal challenges. It is a thermal conduction solution with excellent heat transfer capabilities.
The ATS-16F-49-C1-R0 is designed to take the heat away from a high-power application and move it to an area of lower thermal mass. The heat spreader is designed to dissipate and disperse the heat over a large area to reduce the thermal concentration and prevent thermal runaway. This is accomplished by utilizing high-performance materials such as copper or aluminum and incorporating different heat spreading and heat rejection techniques. The heat spreader features a dielectric epoxy coating that provides additional protection against oxidation.
The ATS-16F-49-C1-R0 also offers excellent thermal performance through a medium-sized enclosure design. The enclosure is designed to keep the internal components from exposure to higher ambient temperatures, while still providing a large thermally exposed surface area to maximize cooling efficiency. The internal components are securely attached to the enclosure using a number of methods including screws, rivets, or adhesive material. This secure attachment keeps the internal components from becoming loose during operation.
The ATS-16F-49-C1-R0 also offers a high thermal efficiency rating, enabling it to effectively transfer more heat out of the application at a faster rate than other solutions. The heat sink also features a step-by-step thermal analysis process to ensure optimal performance. This ensures that the temperature of the device is maintained at safe levels and that the power consumption of the device is kept within an acceptable range.
The ATS-16F-49-C1-R0 heat sink is an excellent choice for applications requiring advanced thermal management solutions. It offers high performance and reliable thermal conduction capabilities that are superior to many other available thermal management solutions. The enclosure design is designed to keep the internal components from exposure to higher ambient temperatures, while still providing a large thermally exposed surface area to maximize cooling efficiency. The ATS-16F-49-C1-R0 is an ideal solution for applications that require a way to effectively and safely siphon off heat, while still delivering high-quality performance.
The specific data is subject to PDF, and the above content is for reference