| Allicdata Part #: | ATS-16F-55-C1-R0-ND |
| Manufacturer Part#: |
ATS-16F-55-C1-R0 |
| Price: | $ 3.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16F-55-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.92446 |
| 30 +: | $ 2.84550 |
| 50 +: | $ 2.68733 |
| 100 +: | $ 2.52926 |
| 250 +: | $ 2.37119 |
| 500 +: | $ 2.29216 |
| 1000 +: | $ 2.05503 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 23.94°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important part of any electronic system. Heat sinks are essential components for expelling heat away from sensitive components and preventing overheating. The ATS-16F-55-C1-R0 thermal heat sink is a highly efficient design with excellent heat dissipation characteristics and is suitable for a variety of applications.
Design and Construction: Constructed of anodized aluminum, the ATS-16F-55-C1-R0 features a unique finned design that provides maximum heat transfer to the surrounding environment. The fins are arranged in a triangular pattern that maximizes their surface area and ensures proper air flow around them. The heat sink is designed to be simple to install and requires no additional mounting hardware. The fins are also designed to be corrosion resistant, making it suitable for use in harsh environments.
Performance: The ATS-16F-55-C1-R0 provides excellent heat transfer performance. Its design allows for maximum surface area to be in direct contact with the air, giving it greater heat dissipation capability. The fins are engineered in a triangular pattern, resulting in an effective venting system that efficiently moves warm air away from components. This ensures that sensitive parts are kept at safe and optimal temperatures.
Application Field: The ATS-16F-55-C1-R0 is a great option for many electronic applications. It is suitable for high-temperature industrial environments such as oil and gas processing, as well as in medical and military operations. It can also be used in consumer electronics like computers, laptops, and set-top boxes. The heat sink is also used in LED lighting, power supplies, and automotive applications.
Working Principle: The ATS-16F-55-C1-R0 works on the basic principle of convection. Heat generated from the components is transferred to the fins, which in turn dissipate it into the air. Since the fins are arranged in a triangular pattern, it allows for increased air flow around them. The fins act as a buffer, absorbing heat before it can cause damage to other components. In addition, the anodized aluminum construction helps to further enhance the efficiency of heat transfer.
The ATS-16F-55-C1-R0 is a compact and lightweight thermal heat sink that offers excellent performance in a variety of environments. Its efficient design and high-quality construction make it well suited for a variety of electronic applications, including industrial, medical, and military applications. With its corrosion-resistant construction and simple installation process, the ATS-16F-55-C1-R0 is an ideal choice for thermal management needs.
The specific data is subject to PDF, and the above content is for reference