| Allicdata Part #: | ATS-16F-60-C1-R0-ND |
| Manufacturer Part#: |
ATS-16F-60-C1-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16F-60-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-16F-60-C1-R0 heat sink is designed to handle high amounts of heat generated by electronic devices and components. This type of heat sink is ideal for applications that require large amounts of thermal dissipating power without occupying a lot of space. This makes them ideal for applications where a low-profile design is desirable, or where space is limited. This article will discuss the application fields and working principle of this type of heat sink.
Application Fields
The ATS-16F-60-C1-R0 heat sink is suitable for a wide range of applications, including:
- Computers
- Laser Equipment
- LED Lighting
- High-Power Transistors
- Power Amplifiers
- Medical Devices
- Telecom Equipment
These types of heat sinks can also be used in air conditioning and refrigeration systems. They can provide additional cooling capacity and reduce the overall energy consumption of the system.
Working Principle
The ATS-16F-60-C1-R0 heat sink is a type of passive cooling system. It relies on convection, radiation, and conduction to transfer heat from the electronic device or component to the environment. Heat is first absorbed by the fins on the heat sink and then dissipated to the atmosphere. The fins increase the surface area of the heat sink, allowing for greater heat transfer.
The heat sink also relies on natural convection and radiation. Warm air around the device will rise due to natural convection. This warm air will then be cooled by the fins on the heat sink and replaced with cooler air from the environment. Heat can also be radiated away from the device, but this is a less efficient form of cooling.
Finally, the heat sink is also designed to conduct heat away from the device. This is done by the use of a thermal compound, which fills any imperfections between the device and the heat sink. This helps to reduce thermal resistance and improve the overall cooling performance of the device.
Conclusion
The ATS-16F-60-C1-R0 heat sink is a versatile cooling system that can be used in a wide variety of applications. It utilizes a combination of convection, radiation, and conduction to efficiently dissipate heat away from hot electronic devices and components. This type of heat sink is ideal for low-profile designs where space is limited. It is reliable and cost-effective solution for managing the excessive heat generated by electronic components.
The specific data is subject to PDF, and the above content is for reference