| Allicdata Part #: | ATS-16F-62-C1-R0-ND |
| Manufacturer Part#: |
ATS-16F-62-C1-R0 |
| Price: | $ 3.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16F-62-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.16197 |
| 30 +: | $ 3.07671 |
| 50 +: | $ 2.90581 |
| 100 +: | $ 2.73489 |
| 250 +: | $ 2.56397 |
| 500 +: | $ 2.47851 |
| 1000 +: | $ 2.22211 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 16.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-16F-62-C1-R0 is a thermal heat sink in the family of thermal solutions offered by ATS Thermal Solutions. It is designed to provide efficient heat dispersion for cooling devices, such as microprocessors, ASICs, circuit boards and high power components. It is a low profile solution with a maximum operating temperature of 150C. It also features a high degree of thermal conductivity, which allows for efficient transfer of heat from the device to the heat sink.
The ATS-16F-62-C1-R0 has a wide range of applications, including microelectronics packages such as ASICs and FPGAs, as well as general electronic components. It is well-suited for applications requiring high-temperature operation, and its low profile design allows for easy integration into tight spaces and tight budgets.
The ATS-16F-62-C1-R0 thermal heat sink works by dissipating heat away from the targeted component. The heat is conducted away via the heat sink to allow for proper device operation. The heat sink is composed of a series of fins, which allow the device to maintain a moderate and safe operating temperature. The fins help spread the heat away from the device, dissipating it into the surrounding environment.
The heat sink works most efficiently when positioned above the device, allowing the heat to be conducted up and away from the device. The heat sink’s fins help to spread the heat away from the device in all directions, creating an efficient path for heat dispersion. This allows the device to remain at a safe operating temperature, which helps to extend its life and improve its performance.
The ATS-16F-62-C1-R0 thermal heat sink is a reliable and efficient solution for cooling electronic components. Its low profile design and high thermal conductivity make it well-suited for a wide range of applications. It is also easy to integrate into tight spaces and tight budgets. The device helps to ensure safe operation of electronics, helping to extend the device’s life and improve its performance.
The specific data is subject to PDF, and the above content is for reference