| Allicdata Part #: | ATS-16F-65-C3-R0-ND |
| Manufacturer Part#: |
ATS-16F-65-C3-R0 |
| Price: | $ 4.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16F-65-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.15233 |
| 30 +: | $ 3.92175 |
| 50 +: | $ 3.69104 |
| 100 +: | $ 3.46040 |
| 250 +: | $ 3.22971 |
| 500 +: | $ 2.99902 |
| 1000 +: | $ 2.94134 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.40°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are often required in electronic applications to ensure that components, especially heat-sensitive components, can remain within their safe temperature ranges and prevent damage or failure. Heat sinks are the most common form of thermal management solutions used for this purpose. ATS-16F-65-C3-R0 is a type of heat sink that is widely used and has been used within the commercial, medical and military industries for decades. In this article, we will take a look at the application field and working principle of ATS-16F-65-C3-R0.
The ATS-16F-65-C3-R0 is a fan-assisted aluminum heat sink designed for high power applications. It utilizes a radial fin array with rounded edges, and the edges are tapped to accept mounting bolts. It offers excellent thermal conductivity combined with good cooling performance. Additionally, its design allows for maximum compatibility with the dimensions of a majority of modern power electronic components. The device is also tested and certified to meet military standards, which demonstrates its reliability.
The primary function of a heat sink is to dissipate the excessive heat generated from a component or device. A heat sink disperses and releases the heat through one or more of its methods, such as through radiation, conduction, and convection. Heat sinks typically consist of a finned or grooved surface, which absorbs and gradually releases the heat to the surrounding environment. This in turn helps to keep the temperature of the component within its safe operating range.
The ATS-16F-65-C3-R0 operates on a similar principle. The device is designed with a passive cooling system that allows it to maintain the highest rate of heat dissipation. The heat is transferred from the electronic component to the aluminum fins by conduction. The thermal management capabilities of the device are further strengthened by the addition of the fan, which helps to circulate the air across the finned surface and further enhances the heat dissipation capability of the heat sink.
The ATS-16F-65-C3-R0 is suitable for use in numerous applications, including automotive, computer and telecommunications, industrial applications, and medical and military applications. The device is often used in high power, high temperature applications, such as onboard computers, LED lights, and server boards. In addition, it can be used for cooling low power circuits such as microcontrollers. The device is also popular with manufacturers of electronic brake systems, as the superior thermal management capabilities and low power consumption make it an ideal choice.
The ATS-16F-65-C3-R0 is a popular and reliable choice among many thermal management solutions. It offers efficient heat dispersion and provides a reliable cooling performance for a variety of applications. Its reliability is tested and certified to meet military standards, which ensures the device is suitable for a wide range of uses in the commercial, medical, and military industries.
The specific data is subject to PDF, and the above content is for reference