ATS-16F-86-C2-R0

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Thermal management has become a very important part of modern electronics and equipment because electronic components can easily be damaged by excessive or prolonged heat. Thermal-heat sinks are designed to increase the surface area of the component and allow for improved thermal dissipation, and the ATS-16F-86-C2-R0 thermally-controlled heat sink is an excellent example of a reliable and effective design. This article will discuss the application field and working principle of the ATS-16F-86-C2-R0.

The ATS-16F-86-C2-R0 is designed to be used in a variety of applications, including power electronics, HVAC equipment, and telecommunications systems. It is suitable for applications that require rated thermal dissipation of 2 W, and features a mechanical operation temperature of -40°C to 80°C.In addition, it has an overall size of 80mm x 16mm and can easily be mounted on a variety of substrate materials. It also features a thermally conductive adhesive that ensures a strong thermal bond between the heat sink and the substrate.

The ATS-16F-86-C2-R0 utilizes a simple yet effective working principle in order to dissipate heat from the substrate. The heat sink consists of a large number of metal clips that are arranged in a honeycomb-like pattern. These clips form individual cells, each with a small amount of air inside that can act as an insulator. This helps to reduce direct contact with the substrate and allows for a more efficient thermal transfer.The thermal control feature of the ATS-16F-86-C2-R0 allows the user to choose between two separate levels of thermal dissipation, allowing for greater flexibility and efficiency.The heat sink also has a fan-out option that allows the device to be to quickly dissipate heat from multiple points on the substrate.

In order to ensure optimal efficiency and reliability, the ATS-16F-86-C2-R0 heat sink utilizes a unique thermal bonding system. This system consists of a thermally conductive adhesive layer between the heat sink and the substrate, ensuring a strong thermal bond that prevents thermal degradation of components. Additionally, the adhesive layer contains a high-temperature resistant material that prevents the heat sink from melting or deforming in high-temperature environments, allowing for a longer lifespan of the device.

The ATS-16F-86-C2-R0 thermal-heat sink is an excellent choice for applications requiring efficient and reliable thermal dissipation. With its simple yet effective working principle, the ATS-16F-86-C2-R0 offers superior thermal performance in a package that fits a variety of different substrate materials. Its unique thermal bonding system ensures a reliable thermal connection between the substrate and the heat sink, preventing any thermal degradation of components. The fan-out option allows for a quick and efficient dissipation of heat from multiple points on the substrate, and its overall size and mechanical temperature rating make it suitable for a wide array of applications. All of these factors make the ATS-16F-86-C2-R0 a reliable and effective thermal-heat sink for any electronic design.

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