| Allicdata Part #: | ATS27609-ND |
| Manufacturer Part#: |
ATS-16G-11-C2-R0 |
| Price: | $ 4.06 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16G-11-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.68550 |
| 10 +: | $ 3.58596 |
| 25 +: | $ 3.38663 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical component of any electronics or energy efficiency system. The ATS-16G-11-C2-R0 is a powerful and reliable thermal solution for many applications. It is typically used in medium and high power applications which require efficient cooling, high thermal conductivity, and low noise. This versatile heat sink is designed to operate with high temperatures and low pressure.
The ATS-16G-11-C2-R0 is a full size active heat sink, designed to provide high performance cooling for a wide range of electronic devices. It features a low profile design with an optimized fin geometry. The air-flow channels maximize heat transfer, while allowing air to flow freely through the fins and cooling the device. The heat sink utilizes a high grade aluminum base with an embedded copper core, maximizing heat transfer performance and increasing the longevity of the system.
The ATS-16G-11-C2-R0 is designed to provide thermal management for high power electronics. It is typically used for continuous operation or short-time overloads, such as during peak power demands or overclocked situations. The device features an impressive thermal conductivity of up to 11W/mK, and a tested thermal resistance of 0.8°C/W. This provides fast and efficient thermal management for processors, memory modules, GPUs, and other high power devices.
The ATS-16G-11-C2-R0 is also designed with the durability and reliability to sustain long-term use. It has been specifically tested for dynamic and static loads up to 150kg. Its heat-dissipating fins are capable of handling temperatures up to 140°C. This allows the device to safely handle heavy work loads, while relying on the thermal conductivity of the aluminum and copper base to keep things cooler.
The ATS-16G-11-C2-R0 is a highly versatile heat sink which can be used in multiple environments. It can operate in both liquids and air, and can even be used in extreme temperatures and in dusty environments. The heat-dissipating fins are resistant to corrosion and chemical damage, allowing for long-lasting performance.
The ATS-16G-11-C2-R0 is a powerful thermal solution, capable of handling higher power levels with increased reliability. Its optimized fin geometry and high-grade aluminum base make it a durable and reliable choice for many electronics applications. Its versatile design allows for operation in air or liquids, and in extreme temperatures and harsh environments. The heat sink is an excellent choice for applications requiring efficient cooling, high thermal conductivity, and reliable performance.
The specific data is subject to PDF, and the above content is for reference