| Allicdata Part #: | ATS-16G-115-C1-R0-ND |
| Manufacturer Part#: |
ATS-16G-115-C1-R0 |
| Price: | $ 3.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16G-115-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.93643 |
| 30 +: | $ 2.85705 |
| 50 +: | $ 2.69829 |
| 100 +: | $ 2.53953 |
| 250 +: | $ 2.38085 |
| 500 +: | $ 2.30148 |
| 1000 +: | $ 2.06339 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.31°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are devices used to transfer heat generated by an electronic component and dissipate it into the environment. ATS-16G-115-C1-R0 is a type of Heat Sink designed with advanced technology to optimize the balance between thermal performance and the form factor.
The ATS-16G-115-C1-R0 Heat Sink is an ideal product for high-density, high-heat environments. Its design combines a minimal form factor with maximum thermal performance. The Heat Sink is constructed from black anodized extruded aluminum and features a sturdy copper base for improved thermal performance.
The Heat Sink is designed with an innovative patented structure for improved thermal performance. It features 12 fins on each side configured to create vertical ventilation and three heat-dissipating fins above each side. These fins allow air to pass through and absorb the temperature while the cooled air is released outside. This efficient design allows the Heat Sink to effectively dissipate heat from an electronic component to the surrounding environment.
The ATS-16G-115-C1-R0 Heat Sink is small in size but still packs a lot of thermal power. Its patented multilayer design ensures maximum thermal performance while its slim design allows it to easily fit into space-constrained environments. The Heat Sink also comes with four mounting holes allowing it to be secured to a variety of materials. This makes it easy to mount the Heat Sink onto a panel, chassis, bracket, or other structure.
The ATS-16G-115-C1-R0 Heat Sink is suitable for a wide variety of applications including industrial cameras, computers, and electronic components. It is also ideal for high-power LEDs due to its efficient thermal transfer capabilities. The Heat Sink s engineered to fit into confined spaces with minimal impact on the overall design.
The ATS-16G-115-C1-R0 Heat Sink is perfect for applications where thermal performance is critical and space is limited. Its unique multilayer design allows it to dissipate heat more efficiently while occupying less space than standard Heat Sinks. Its robust construction ensures a long-lasting product life, while its slim design offers increased flexibility in installation.
The specific data is subject to PDF, and the above content is for reference