| Allicdata Part #: | ATS27620-ND |
| Manufacturer Part#: |
ATS-16G-12-C2-R0 |
| Price: | $ 4.16 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16G-12-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.78000 |
| 10 +: | $ 3.67794 |
| 25 +: | $ 3.47382 |
| 50 +: | $ 3.26957 |
| 100 +: | $ 3.06520 |
| 250 +: | $ 2.86086 |
| 500 +: | $ 2.65651 |
| 1000 +: | $ 2.60542 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are designed to dissipate heat away from their surfaces, allowing other objects or electronics to operate in cooler temperatures. ATS-16G-12-C2-R0 thermal heat sink is a type of heat sink specifically designed for electronics that require a lot of power and, as a result, produce a lot of heat. By dissipating this heat away from the electronics, ATS-16G-12-C2-R0 thermal heat sink helps keep the electronics functioning optimally and extend their life span.
Application Field of ATS-16G-12-C2-R0 Thermal Heat Sink
The ATS-16G-12-C2-R0 thermal heat sink is commonly used in a variety of applications, especially in the electronics industry. It is used for cooling electronic devices such as microprocessors, transistors, and other high-powered electronics. It is a popular choice for many high-end electronics. It is also used to keep gaming consoles, laptops, and other electronics that are equipped with powerful processors and GPUs cool during periods of intensive graphics or processing tasks.
Working Principle of ATS-16G-12-C2-R0 Thermal Heat Sink
The ATS-16G-12-C2-R0 thermal heat sink works by dissipating heat away from the source and into the air. It utilizes the principles of thermodynamics to achieve this. Heat is lost when cooler molecules in the air come into contact with the hot surface of the thermal heat sink, resulting in a heat transfer called conduction. A fan is usually used to increase the conduction process by forcing more air onto the surface of the heat sink. This is called forced convection and is the primary mechanism by which the ATS-16G-12-C2-R0 thermal heat sink dissipates heat.
The ATS-16G-12-C2-R0 thermal heat sink also utilizes radiation to maximize the amount of heat lost. Radiation is the emission of heat energy in the form of electromagnetic waves. This heat energy is transferred away from the source and into the surrounding air. This process is known as radiation, and it is the secondary mechanism utilized by the ATS-16G-12-C2-R0 thermal heat sink to dissipate heat away from the source.
Generally speaking, the ATS-16G-12-C2-R0 thermal heat sink is an ideal choice for electronics that require a lot of power and generate a lot of heat. Its efficient dissipation mechanisms and lightweight design make it a popular option for gamers, computer technicians, and anyone else dealing with high-powered, overheating electronics.
The specific data is subject to PDF, and the above content is for reference