| Allicdata Part #: | ATS27621-ND |
| Manufacturer Part#: |
ATS-16G-120-C2-R0 |
| Price: | $ 3.95 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16G-120-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.59100 |
| 10 +: | $ 3.49335 |
| 25 +: | $ 3.29918 |
| 50 +: | $ 3.10502 |
| 100 +: | $ 2.91098 |
| 250 +: | $ 2.71691 |
| 500 +: | $ 2.52285 |
| 1000 +: | $ 2.47433 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.48°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management techniques play an important role in preventing overheating in various electronic applications. It is the key ingredient in ensuring optimal performance from an electronic system and balance the power of a device with its cooling needs.
ATS-16G-120-C2-R0: The ATS-16G-120-C2-R0 is a thermal – heat sink that is designed to be used for removing heat from a variety of electronic components. It has a mounting plate with multiple layers that provide superior thermal and heat dissipation performance. The device has an extended service life, with a total height of 24mm and a hole center distance of 8.5 mm. This thermal – heat sink has an optimizing structure and is designed to dissipate heat more quickly and efficiently while at the same time providing greater stability.
Application Field: ATS-16G-120-C2-R0 thermal – heat sink can be used in a wide range of electronic applications, including device protection, cooling, power regulation, productivity and protection from electrical shock hazards in industrial, medical, and communication electronic devices. This device is suitable for operating temperature range up to 105°C and is highly reliable when operating in certain environments. Its durability and extendable service life make it an ideal choice for customers looking for a long-term solution to heat sink applications.
Working Principle: Heat sinks are designed to transfer heat from one area of the device to another location, usually at a higher temperature. The ATS-16G-120-C2-R0 thermal – heat sink uses a combination of natural convection and forced convection to increase the rate of Heat transfer. The mounting plate has multiple layers, which act as air intakes and exhausts that facilitate the efficient transfer of heat from the device to the surroundings. The heat sink also utilizes an optimizing structure and has strategically placed fins to increase the surface area and enhance heat dissipation.
The ATS-16G-120-C2-R0 thermal – heat sink is an effective and reliable solution for transferring heat away from electronics with optimum performance and increased lifespan. Its superior design, along with its multiple layers and strategically placed fins, make it a cost-effective choice for applications requiring reliable thermal management solutions.
The specific data is subject to PDF, and the above content is for reference