| Allicdata Part #: | ATS-16G-14-C1-R0-ND |
| Manufacturer Part#: |
ATS-16G-14-C1-R0 |
| Price: | $ 3.68 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16G-14-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.34026 |
| 30 +: | $ 3.25017 |
| 50 +: | $ 3.06974 |
| 100 +: | $ 2.88912 |
| 250 +: | $ 2.70857 |
| 500 +: | $ 2.61828 |
| 1000 +: | $ 2.34741 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.96°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical process for any electronic application, and heat sinks play a pivotal role in ensuring proper performance. The ATS-16G-14-C1-R0 is an advanced heat sink designed for high power applications and for use in highly thermally sensitive applications. This heat sink is designed to move heat away from the device and to keep it away from critical components.
The ATS-16G-14-C1-R0 is designed for applications that require high thermal conductivity, such as in the medical industry or in military applications. The heat sink has a low profile design, which allows for a compact form factor and helps to reduce the total package size. The ATS-16G-14-C1-R0 also features high-end materials to aid in thermal transfer. It is constructed of copper for high heat transfer and a nickel-plated copper base for a low contact thermal resistance. The ATS-16G-14-C1-R0 also utilizes its patented fin design for reduced contact thermal resistance and improved efficiency.
The ATS-16G-14-C1-R0 has two mounting options, the first being top-mounting and the second being side-mounting. When side-mounting the device, the fin design helps to reduce air drag and provide more surface area for efficient heat transfer. This, in turn, helps to improve the thermal performance of the device. When top-mounted, the heat sink helps to effectively direct the heat away from the device. The patented symmetrical fin design provides low flow resistance and helps to increase the performance of the device.
The ATS-16G-14-C1-R0 is an ideal solution for high power applications and highly thermally sensitive applications. It utilizes its patented fin design to help reduce contact thermal resistance and increase the overall thermal performance of the device. The device\'s low profile design helps to reduce the total package size and increase the efficiency of the heat transfer process. The ATS-16G-14-C1-R0 is constructed of high-end materials for optimal thermal transfer and is available in two mounting options, top-mounted and side-mounted. With its low profile design and patented fin design, the ATS-16G-14-C1-R0 is an ideal solution for any application that requires a reliable and efficient thermal management system.
The specific data is subject to PDF, and the above content is for reference