ATS-16G-141-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-16G-141-C3-R0-ND

Manufacturer Part#:

ATS-16G-141-C3-R0

Price: $ 3.57
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X10MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16G-141-C3-R0 datasheetATS-16G-141-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.24576
30 +: $ 3.15777
50 +: $ 2.98229
100 +: $ 2.80690
250 +: $ 2.63146
500 +: $ 2.54374
1000 +: $ 2.28059
Stock 1000Can Ship Immediately
$ 3.57
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.90°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks are a type of cooling component used in many different types of applications. They are designed to absorb and dissipate heat generated by various components in electrical devices, such as CPUs, GPUs, and power transistors. ATS-16G-141-C3-R0 is a thermal heat sink specifically designed for power transistors in high power applications.

The ATS-16G-141-C3-R0 is made of black anodized aluminum alloy, which provides excellent heat conductivity. It also features a copper core to create a large thermal contact area between the power transistor and heat sink. The large contact area helps dissipate heat efficiently and quickly. The copper core also improves the longevity of the heat sink due to its corrosion resistance properties. The ATS-16G-141-C3-R0 also features high thermal capacity to ensure maximum heat dissipation even when the power transistor is subjected to high temperature conditions.

The ATS-16G-141-C3-R0 is designed to fit power transistors in a variety of electrical components, such as power supplies, motor controllers, drivers, and power amplifiers. It is also capable of working with more than one power transistor simultaneously. The heat sink is easy to install due to its low-profile design which allows for tight mounting configurations. It also features mounting holes to provide secure mounting possibilities.

The ATS-16G-141-C3-R0 works by drawing heat away from the power transistors via the heat sink’s heat absorbing abilities. Heat is then dissipated away from the component by way of the fins positioned on the top of the heat sink. The air passing over the fins carries away the heat thus providing cooling to the component. The fin design of the ATS-16G-141-C3-R0 also helps to increase the heat dissipation area, thus providing even more cooling efficiency.

The ATS-16G-141-C3-R0 thermal heat sink is designed to provide quick and efficient cooling solutions for power transistors in high power applications. Its anodized aluminum alloy construction, copper core, and fin design allow for maximum heat absorption and dissipation. It is easy to install and fits in many different types of electrical components. Thus, the ATS-16G-141-C3-R0 is a great choice for those looking for a reliable cooling solution for a variety of power transistors.

The specific data is subject to PDF, and the above content is for reference

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