| Allicdata Part #: | ATS-16G-148-C3-R0-ND |
| Manufacturer Part#: |
ATS-16G-148-C3-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16G-148-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.73°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are key components in systems which dissipate heat away from sensitive components and devices. The ATS-16G-148-C3-R0 is a unique heat sink designed for use in electronic systems where heat must be managed and dissipated. The unique design of this heat sink makes it able to effectively and reliably dissipate heat away from sensitive components, while at the same times being an energy-efficient solution to managing heat.
The ATS-16G-148-C3-R0 is a combination of a base plate and a top plate with an array of fins that are thermally bonded to the two plates. The base plate is made up of a copper-based material that is carefully designed to provide excellent thermal conductivity, with a high thermal mass capacity. This base plate also includes a number of strategically placed air vents, which help to dissipate heat away from sensitive components. The top plate is designed to produce maximum surface area, allowing for maximum heat dissipation with minimal effort. The fins are brazed into the top plate, increasing the surface area by providing a larger surface area that can dissipate more heat.
The ATS-16G-148-C3-R0 heat sink can be used in a variety of electronic systems. It can be used to dissipate heat from high-power LED bulbs, semiconductor systems, and other heat-sensitive components. It is ideal for applications where high levels of heat must be managed without compromising component integrity. It is also extremely efficient, allowing for maximum heat dissipation without consuming an excessive amount of energy.
The ATS-16G-148-C3-R0 heat sink is one of the most efficient and reliable thermal management solutions available. It is a perfect solution for managing large amounts of heat in sensitive electronic systems. Its unique design ensures that heat is effectively and reliably dissipated away from sensitive components, while still allowing for maximum air flow and energy efficiency. This heat sink is an excellent choice for any application where thermal management and energy efficiency are essential.
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