| Allicdata Part #: | ATS27664-ND |
| Manufacturer Part#: |
ATS-16G-16-C2-R0 |
| Price: | $ 4.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16G-16-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.05090 |
| 10 +: | $ 3.94443 |
| 25 +: | $ 3.72506 |
| 50 +: | $ 3.50608 |
| 100 +: | $ 3.28690 |
| 250 +: | $ 3.06777 |
| 500 +: | $ 2.84864 |
| 1000 +: | $ 2.79387 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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This article will discuss the application field and working principle of ATS-16G-16-C2-R0, which falls into the Thermal - Heat Sinks category.
Introduction
ATS-16G-16-C2-R0 is a highly-efficient heat sink designed for use in the thermal management of electronics. Specifically, it is designed to remove heat from power transistor, microelectronic, and other circuit devices that require a substantial amount of cooling. In addition to cooling power transistors, this heat sink can also be used to dissipate larger chip-level devices and modules.
Application Field
ATS-16G-16-C2-R0 is most often used in the cooling of power transistors and other high-power devices. It is particularly effective in applications where a significant amount of heat must be moved in order to increase the efficiency of the device. Some examples of applications include high-power amplifiers, DC-DC power converters, LED drivers, and audio amplifiers.
This heat sink is also widely used for cooling microelectronic devices, such as microprocessors, microcontrollers, memories, and FPGAs. Due to its superior thermal performance, it can be used to provide effective cooling for devices with high power consumption, such as video cards and processors.
Working Principle
The working principle of the ATS-16G-16-C2-R0 heat sink is based on the idea that heat always moves from hot to cold. The heat sink contains an array of fins made of aluminum or copper, which are exposed to the ambient air. As the fins absorb the heat from the power transistor or other device, the heat transfers to the surrounding air, concentrating the heat near the fins. This increase in the air temperature causes convection currents, which transport the heat away from the device.
The effectiveness of the ATS-16G-16-C2-R0 heat sink can be increased by increasing its surface area or by providing air flow around the fins. This can be achieved by adding a fan, which increases the efficiency of the heat transfer process. Additionally, the heat sink can be designed to have a low thermal resistance, which enables it to absorb more heat and dissipate it faster.
Conclusion
In conclusion, the ATS-16G-16-C2-R0 heat sink is an effective way to remove heat from power transistor and other high-power devices. It is widely used in applications such as power amplifiers, DC-DC power converters, LED drivers, and audio amplifiers. Additionally, the working principle of the heat sink is based on the idea that heat always moves from hot to cold. By increasing its surface area or providing air flow around the fins, the effectiveness of the heat sink can be improved, allowing it to dissipate more heat faster.
The specific data is subject to PDF, and the above content is for reference