ATS-16G-176-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.73°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are essential components in many electronic and mechanical systems as they provide effective and efficient heat dissipation. The ATS-16G-176-C3-R0 heat sink features a patented design that is designed to dissipate heat evenly and quietly from high-powered transistors, processors, and 24V transformers. The ATS-16G-176-C3-R0 is an industry leader when it comes to thermal solutions with its innovative construction and superior heat exchange capabilities.

Application fields

The ATS-16G-176-C3-R0 heat sink is most frequently used in the power electronics industry. This is due to its incredible thermal performance, which allows it to block up to 30°C delta T of heat from components in the system. This effective heat dissipation ensures that the system components remain at safe operating temperatures without the risk of overheating or over-cooling. The ATS-16G-176-C3-R0 is also commonly used in various commercial and industrial applications as it can provide effective and efficient thermal solutions in a variety of sources. This includes server enclosures, embedded system components, medical device housings, and green power-saving appliances. The ATS-16G-176-C3-R0 also excels in the automotive industry as it is designed to dissipate heat generated by high-power motors. In addition, the ATS-16G-176-C3-R0 is one of the most popular choices for designers and manufacturers of professional gaming equipment due to its ability to provide a nearly silent cooling solution and dissipate heat quickly and evenly.

Design and Materials

The ATS-16G-176-C3-R0 is constructed from premium grade aluminum and is designed to guarantee maximum heat dissipation. This is achieved through its patented fin design, which is engineered to limit the potential for thermal binding and ensure that hot areas remain at safe temperatures.The ATS-16G-176-C3-R0 also features an innovative thermo-coupled design, which allows for optimum thermal performance through efficient heat exchange. This is achieved by dissipating heat along the surface of the heat sink thanks to its high surface area. The ATS-16G-176-C3-R0 is also treated with a corrosion-resistant coating for improved durability and long-term use.

Working Principle

The ATS-16G-176-C3-R0 is designed to dissipate heat generated by electronic components such as processors and transistors. This is achieved through the heat sink\'s patented fin design and thermal coupling design. As the heat is generated in components, the fins absorb and dissipate the energy, while the thermal coupling allows for optimum thermal performance by spreading the heat along the surface of the heat sink.The ATS-16G-176-C3-R0\'s design also ensures efficient heat exchange, as it is designed to direct heat away from the components and ensure that hot spots are minimized. The heat sink also features a corrosion-resistant coating for improved durability, increasing the lifespan of the heat sink.

Conclusion

Thermal - Heat Sinks play an important role in many electronic and mechanical systems. The ATS-16G-176-C3-R0 heat sink is designed to provide effective and efficient thermal solutions in a wide variety of applications. Its patented fin design and thermal coupling design offer optimum thermal performance by dissipating heat quickly and evenly. In addition, the heat sink features a corrosion-resistant coating that ensures it remains in working condition for many years.

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