ATS-16G-20-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.14°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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IntroductionThermal - Heat Sinks are devices used to transfer heat from a source of heat to an area where it needs to be dissipated. ATS-16G-20-C2-R0 is a thermal heat sink designed for power electronic applications, such as motor drives, power supplies, battery chargers, and other high-power industrial applications. This device is designed to provide superior performance and efficient heat dissipation for power converters and other electronic devicesATS-16G-20-C2-R0 OverviewThe ATS-16G-20-C2-R0 thermal heat sink is designed to provide superior heat dissipation and performance even in high-power applications. This device features a polished aluminum plate with a heat sink base made of aluminum alloy and high-density thermal interface material (TIM). The base incorporates an active air cooling fan and a base plate for improved thermal efficiency. It also includes two heat sink pins for increased surface area contact with the heatsink and improved heat transfer.The ATS-16G-20-C2-R0 is designed to offer an optimal balance between dissipation and thermal performance with high-power density. The device offers excellent cooling efficiency with low thermal resistance in a compact size. It is UL rated for use in a wide variety of environments, including those with high temperatures.Working PrincipleThe working principle of the ATS-16G-20-C2-R0 thermal heat sink is based on the concept of heat conduction. Heat is transferred from the source of heat to the heatsink by means of thermal conduction. The aluminum plates and pins offer superior thermal contact with the heatsink, allowing for efficient heat transfer. The fan draws in air from outside the enclosure and forces it through the heatsink, providing active cooling. The air cools the heat sink surface and removes excess heat from the source.Application FieldThe ATS-16G-20-C2-R0 thermal heat sink is designed for power electronic applications, such as motor drives, power supplies, battery chargers, and other high-power industrial applications. This device is also suitable for use in computing and telecommunications equipment, automotive electronics, and in general, any application where high-power dissipation and superior thermal performance are needed. The ATS-16G-20-C2-R0 is designed to reduce thermal resistance, improve heat dissipation, and provide more efficient power conversion in a variety of applications. The device is equipped with UL certifications, and meets or exceeds the safety requirements for the United States and Canada.ConclusionThe ATS-16G-20-C2-R0 thermal heat sink is designed for high-power applications, such as motor drives, power supplies, and battery chargers. This device offers excellent thermal performance and improved heat dissipation. It features a polished aluminum plate with a heatsink base made of aluminum alloy and high-density TIM. It also includes an active air-cooling fan and heat sink pins for increased surface area contact with the heatsink and improved heat transfer. This device is UL-certified and suitable for use in a wide variety of environments, including those with high temperatures.

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