| Allicdata Part #: | ATS-16G-31-C3-R0-ND |
| Manufacturer Part#: |
ATS-16G-31-C3-R0 |
| Price: | $ 5.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X5.84MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16G-31-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.96188 |
| 30 +: | $ 4.68657 |
| 50 +: | $ 4.41076 |
| 100 +: | $ 4.13513 |
| 250 +: | $ 3.85946 |
| 500 +: | $ 3.58378 |
| 1000 +: | $ 3.51486 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.230" (5.84mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 25.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A heat sink, also known as a thermal fin or a heatsink, is a device used to transfer and dissipate heat from electronic and mechanical components to the surrounding environment. The ATS-16G-31-C3-R0 is a heat sink or heatsink designed to allow for improved airflow and cooling efficiency while also providing shape and structural stability.
The ATS-16G-31-C3-R0 is a high-performance aluminum heatsink designed for use in a variety of applications. This thermal solution is designed to provide maximum cooling capability for a variety of high-performance components including CPUs, GPUs, and FPGAs requiring heat dissipation. The ATS-16G-31-C3-R0 heatsink features a uniquely designed surface pattern to improve airflow and optimize cooling performance.
The ATS-16G-31-C3-R0 heat sink is ideal for applications where stability, flexibility, and high thermal resistance are required. The aluminum heatsink features a fin design with a base of 3”, and an overall profile height of 25.7mm. The fin structure features an alternating patterns of straight fins and angled fins which allows for improved air flow and maximum heat dissipation. The fin pattern combined with the fin dimensions provides improved thermal resistance, allowing higher power components to be used with greater efficiency.
The ATS-16G-31-C3-R0 heat sink is designed to work with a variety of mounting methods, including snap-in installation. The snap-in installation allows for easy and secure mounting for components within tight spaces. The mounting clips secure the heat sink to the component, making sure that the heat sink does not move or shift due to frequent vibration. The snap-in installation is designed to tightly secure the heat sink to the component, ensuring a secure connection with no gaps or air contact.
The ATS-16G-31-C3-R0 heat sink is designed to provide improved thermal performance and stability for applications that require high performance cooling. The high performance cooling is achieved through the use of the unique fin pattern, which creates a turbulence effect. The turbulence effect ensures that the airflow around the heat sink does not stagnate but continuously circulates, allowing for more efficient thermal dissipation. The fin pattern allows for a large surface area, allowing more heat to be dissipated away from the device.
The ATS-16G-31-C3-R0 heat sink is ideal for use in applications such as high-performance computing, networking, graphics processing, industrial automation, robotics, and other applications that require efficient thermal management. The heatsink is also well suited for fanless designs, as the fin pattern promotes increased airflow and improved thermal efficiency. In fanless designs, relying on the natural circulation of air through the heatsink provides reliable cooling performance and an extended life for the system.
The specific data is subject to PDF, and the above content is for reference