ATS-16G-41-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.280" (57.90mm)
Width:	2.400" (60.96mm)
Diameter:	--
Height Off Base (Height of Fin):	0.700" (17.78mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.02°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are very important for effective cooling and dissipating heat from electronic components. Heat sinks are essential for preventing heat buildup in electronics, preventing damage to associated components and preventing the formation of heated pockets in an electronic system. The ATS-16G-41-C1-R0 heat sink is designed to do exactly that - provide an effective heat dissipation solution for a range of electronic devices. In this article we will explore the application field and working principle of the ATS-16G-41-C1-R0.

Application Field

The ATS-16G-41-C1-R0 heat sink is suitable for use in both commercial and home electronics. Its application field is mainly determined by its size, which allows for more flexibility when selecting other components. It fits well in an electronics cabinet or inside a larger electronics assembly, such as a server or supercomputer. It has been designed with sufficient fin space to ensure proper dissipation of the generated heat, making it suitable for use in a wide range of applications.The ATS-16G-41-C1-R0 heat sink can also be used in automotive electronics. Its size and shape are designed to fit into compact automotive electronics cases, and its fin system ensures that the generated heat is effectively dissipated. The heat sink is able to effectively dissipate the generated heat without the need for an additional heatsink or fan, making it ideal for automotive applications.

Working Principle

The ATS-16G-41-C1-R0 heat sink works by transferring heat from the electronic components to the surrounding air. This is achieved through a combination of convection and radiation. The fins on the heat sink act as a large surface area, which allows the heat to more easily escape into the air. Furthermore, the presence of air-filled pockets between the fins and the heat sink serves to increase the efficiency of the heat transfer.The convection effect is further enhanced by the fan, which circulates the ambient air around the heat sinks. The air that is circulated around the heat sink picks up heat from its surface, cooling the electronic components in the process. Additionally, the fan is able to draw in cooler air from outside the electronics cabinet, further cooling the entire system.

Conclusion

The ATS-16G-41-C1-R0 heat sink is designed to be a highly effective solution for dissipating heat from electronic components. Its relatively small size and shape allows for greater flexibility in component selection, whilst the advanced fin system ensures an effective heat transfer from the components to the surrounding air. Furthermore, its fan ensures that sufficient air is drawn in from outside the electronics cabinet, further cooling the system. The ATS-16G-41-C1-R0 is a highly effective and efficient heat sink solution suitable for use in a wide range of applications.

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