Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	11.50°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Heat sinks are thermal devices that are used to dissipate heat from electronics or other components. They are designed to take the heat away from a component in an efficient manner by dissipating it into the air. Heat sinks are often used to cool electronic components such as CPUs, GPUs, high-power transistors, and other discrete electronic devices. The ATS-16G-46-C1-R0 is a type of heat sink that is designed to provide superior heat dissipation and performance.

ATS-16G-46-C1-R0 Application Field

The ATS-16G-46-C1-R0 is a thermal solution designed for performance and reliability. It is designed to cope with high power dissipation in extremely harsh environments, such as those found in high-end gaming rigs, servers, and scientific research facilities. It is capable of dissipating up to 16 watts of power, making it suitable for applications that require high levels of performance.Due to its ability to dissipate large amounts of power in extreme conditions, the ATS-16G-46-C1-R0 is an ideal solution for applications such as military, aerospace, and scientific research that require high levels of performance and reliability. It is also popular in consumer-level gaming rigs where gamers need the highest performance possible.

ATS-16G-46-C1-R0 Working Principle

The ATS-16G-46-C1-R0 works on the principle of convective heat transfer. This means that it takes heat away from the source component and uses air flow or other forced convection methods to dissipate it away from the component.The ATS-16G-46-C1-R0 utilizes a combination of air-flow, fins, and optimized heat pipes to improve cooling performance. The heat pipes are made of copper and utilize phase-change heat transfer technology to transfer heat away from the source. The air-flow is facilitated by a series of fins running through the heat sink, which encourage cooling air to move through the heat sink and dissipate the heat away from the component.The ATS-16G-46-C1-R0 employs two types of heat conduction, natural convection and forced convection. Natural convection, or heat pipes, relies on the natural tendency of hot air to rise and cold air to sink to disperse heat away from the component. Forced convection uses air movements, such as fans, to circulate air over the heat sink, allowing for more efficient cooling.

Conclusion

The ATS-16G-46-C1-R0 is a thermal solution designed to provide superior heat dissipation and reliability in extremely harsh environments. It utilizes air-flow, optimized heat pipes, and convective heat transfer, as well as natural and forced convection to maximize its cooling performance. The ATS-16G-46-C1-R0 is an ideal solution for applications that require high levels of performance and reliability, and is often used in high-end gaming rigs, servers, and scientific research facilities.

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