ATS-16G-47-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-16G-47-C3-R0-ND

Manufacturer Part#:

ATS-16G-47-C3-R0

Price: $ 3.77
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X30MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16G-47-C3-R0 datasheetATS-16G-47-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.42405
30 +: $ 3.23358
50 +: $ 3.04340
100 +: $ 2.85314
250 +: $ 2.66293
500 +: $ 2.47272
1000 +: $ 2.42517
Stock 1000Can Ship Immediately
$ 3.77
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.58°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks, when used in conjunction with cooling fans, offer an effective way of dissipating heat from electronic components. The ATS-16G-47-C3-R0 is a high-performance, heavy-duty aluminum thermal heat sink that has been designed to provide reliable cooling of these components. This heat sink uses a variety of technologies and materials to effectively and efficiently dissipate heat from the components while maintaining its structural integrity and reliability.

The ATS-16G-47-C3-R0 is composed of a specially designed baseplate and a series of fins. The baseplate is made from an alloy of aluminum and copper, which provides a heat conduction and transfer rate up to 16 W/m°K. It is also designed to be corrosion resistant and capable of operating in ambient temperatures up to 85°C. The fins are manufactured using a high-performance aluminum alloy, which provides superior heat dissipation and stability. The fins are designed for optimal air flow, providing effective heat dissipation over a large area.

The ATS-16G-47-C3-R0 heatsink is designed to be used in conjunction with a fan for effective cooling. The fan is typically mounted on the upper side of the heatsink and is used to draw air through the fins, thus allowing the heat to be dissipated. The fan can also be used to provide additional cooling when the ambient temperature is too high. This combination of technologies provides efficient and reliable cooling of components.

The ATS-16G-47-C3-R0 is suitable for a variety of applications. It is ideal for cooling large or high-power electronic components such as microprocessors, power supplies, and others. It is also ideal for cooling other applications such as LED lights, power amplifiers, and high-end systems. This heat sink is also used in industrial and commercial applications, such as data centers, server rooms, and other high-temperature environments. The heat sink is suitable for most operating environments and can handle up to 230°C.

The ATS-16G-47-C3-R0 heat sink is a versatile and reliable cooling solution for electronics and other components. It provides a dependable and efficient cooling solution, which can be used in a variety of applications. The heat sink is rugged and durable, designed to withstand long-term use and exposure to extreme temperatures. The combination of baseplate and fin technology ensures maximal thermal performance and longevity.

The specific data is subject to PDF, and the above content is for reference

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