| Allicdata Part #: | ATS-16G-63-C3-R0-ND |
| Manufacturer Part#: |
ATS-16G-63-C3-R0 |
| Price: | $ 4.16 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16G-63-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.78252 |
| 30 +: | $ 3.57231 |
| 50 +: | $ 3.36206 |
| 100 +: | $ 3.15195 |
| 250 +: | $ 2.94182 |
| 500 +: | $ 2.73169 |
| 1000 +: | $ 2.67917 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks
Heat sinks are devices that have been used for decades to transfer heat away from components in various types of applications. In modern times, they are mainly used for the cooling of integrated circuits or other heat-generating microelectronics products. Heat sinks are available in a variety of materials and configurations, but one type that is becoming more popular is the ATS-16G-63-C3-R0. This article will discuss the application fields and working principles of the ATS-16G-63-C3-R0.
Application Fields
The ATS-16G-63-C3-R0 is a high-performance, low-cost passive heat sink that can be used in a variety of application fields. It has been designed for use in high-density computing and server-room environments where space and cooling are a major concern. It is also suitable for use in the automotive and medical device industries, due to its efficient heat dissipation and low profile design. Due to its small size, it is popular for use in miniature products, such as those used in robotics.
Working Principle
The ATS-16G-63-C3-R0 works on a very simple principle. Heat is transferred away from the component it is attached to, by means of thermal conduction. This is achieved through the heat sink’s physical contact with the component. As heat is conducted away from the component, it then dissipates through the fins on the rear of the heat sink, the size and shape of which can be designed to enhance the cooling effect.
The ATS-16G-63-C3-R0 also features a ‘cold plate’ design. This involves the heat sink being connected to a cold plate which is in turn connected to a cooling system, such as a fan or a liquid cooling system. This further enhances the cooling capabilities of the heat sink by ensuring that the internal temperature is kept consistent, preventing overheating of the component.
Benefits
The ATS-16G-63-C3-R0 is a high-performance heat sink, and its use has many advantages. Firstly, the size and weight are relatively small, making this type of heat sink suitable for a wide range of applications. Additionally, its low profile design offers improved air flow, allowing for better ventilation, thus enhancing the cooling effect and aiding in the prevention of overheating. Finally, its efficient heat dissipation allows for a greater level of compatibility with cooling systems, leading to longer operational life spans for electronic components.
Conclusion
The ATS-16G-63-C3-R0 is a reliable and efficient passive heat sink that is suitable for a range of different applications. By combining the principles of thermal conduction and cold plate design, it is able to transfer heat away from components, and dissipate it effectively. As a result, this type of heat sink is well-suited for use in high-density computing and other similar environments, as well as in miniature applications. This makes the ATS-16G-63-C3-R0 a versatile and cost-effective solution to cooling problems.
The specific data is subject to PDF, and the above content is for reference