ATS-16G-64-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-16G-64-C3-R0-ND

Manufacturer Part#:

ATS-16G-64-C3-R0

Price: $ 4.35
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X25MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16G-64-C3-R0 datasheetATS-16G-64-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.92112
30 +: $ 3.70335
50 +: $ 3.48541
100 +: $ 3.26762
250 +: $ 3.04978
500 +: $ 2.83194
1000 +: $ 2.77748
Stock 1000Can Ship Immediately
$ 4.35
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.49°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is essential for the reliable operation of any electronic device, as components reach their peak performance levels only when maintained at optimal operating temperatures. One of the most frequently utilized methods of thermal management is use of a heat sink. Heat sinks disperse heat from their source into their immediate environment, allowing components to remain safe and cool – while also ensuring internal temperatures remain within acceptable ranges. The ATS-16G-64-C3-R0 is a state-of-the-art heat sink that is made to fit the needs of both consumer and professional applications alike.

The ATS-16G-64-C3-R0 heat sink is constructed of extruded aluminum fins and a die-cast copper base, providing a material mix that ensures thermal efficiency. Providing superior thermal dissipation and structural strength, it is a popular design choice for many consumers and businesses looking for a cost-effective solution. Its advanced heat sink concept also maximizes surface area while minimizing weight load, giving the device an excellent ratio of performance-to-weight.

The ATS-16G-64-C3-R0 is designed to work in conjunction with a fan to reduce heat in any environment. It is equipped with two mounting pins and one 4-pin PWM fan connector for easy and convenient setup. In addition, it is designed with holes and grooves that are specifically designed to ensure proper airflow for maximum cooling potential. This heat sink also has a snap-on design that allows for easy installation and removal.

The working principle of the ATS-16G-64-C3-R0 heat sink is based on convection. This means that the heat from the source is transferred to the atmosphere through the tin walls of the heat sink. As the material is extremely effective at transferring heat quickly, the heat is dispersed across the surface of the heat sink before dissipating into the environment. Additionally, the fan helps to evacuate the air from the immediate vicinity of the heat sink more quickly and efficiently, allowing cooler air to replace it.

In terms of applications, the ATS-16G-64-C3-R0 heat sink is suitable for a number of different applications, consumer and business alike. Commonly, it is employed in desktop computers, medical machines, routers, and amplifiers where temperature control is required. The heat sink is also used in a variety of other more basic operations, such as cooling consoles, computers, and other consumer electronics to reduce the risk of overheating.

The ATS-16G-64-C3-R0 is a reliable and efficient heat sink that offers superior thermal management in any environment. Utilization of the device’s advanced heat dissipating capabilities provides a cost-effective means of cooling any number of electronic components, from consumer electronics to medical machines. As such, the ATS-16G-64-C3-R0 is a trusted choice for thermal management applications.

The specific data is subject to PDF, and the above content is for reference

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