| Allicdata Part #: | ATS-16G-77-C3-R0-ND |
| Manufacturer Part#: |
ATS-16G-77-C3-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16G-77-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.58°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management of electronics is vital to overall system performance and longevity. Heat sinks provide a physical conduit or mechanism for exchanging thermal energy flowing between a hot component and the devices operating environment. ATS-16G-77-C3-R0 is one type of thermal-heat sink that provides a means of cooling a heat-generating component, allowing it to perform optimally. This article will explain the application field and working principle of ATS-16G-77-C3-R0.
ATS-16G-77-C3-R0 can be used in many different applications. It is an electronic device that helps to keep a component or environment at a safe operating temperature. For example, it can be used to cool computer CPUs, video cards, power supplies, circuit boards, memory modules, LED lighting, or any other electronic component that generates heat. This device is also used in industrial and military applications to maintain correct temperatures for circuit boards. It can also be used in robotics and mechatronics applications to cool important parts such as motors and drives.
The working principle of ATS-16G-77-C3-R0 is as follows. It consists of a metal plate or base that is attached to a heat generating component. The base has a series of fins or extended surfaces that increase the total available surface area. A fan is also attached to the base, which draws air across the fins. The airflow dissipation across the fins causes the heat to disperse away from the component and the environment, keeping the system temperature in check.
The thermal-heat sink consists of a thermally conductive material, such as aluminum or copper, to absorb the heat from the component and dissipate it away from the device. The base of the device is shaped to the exact size of the component that it is intended to cool and is connected to a series of metal fins. The fins are arranged in a way such that they allow for air to pass between them, enabling the heat to be moved away from the component to the environment.
The fan at the base of the heat sink plays a crucial role in cooling the device. The airflow created by the fan helps to dissipate the heat generated from the component, ensuring that the device is not damaged due to overheating. The fan also helps to bring in air from the environment to cool the component, so that the system temperature stays in an acceptable range.
The ATS-16G-77-C3-R0 is a reliable and cost-effective solution for cooling components in electronics. It is easy to install and maintain, and provides effective cooling for a variety of applications. It also works well at high power densities, ensuring that components are kept at stable temperatures that will not damage the system. By utilizing the ATS-16G-77-C3-R0 thermal-heat sink, electronics can be cooled effectively, ensuring optimal performance and long-term operation.
The specific data is subject to PDF, and the above content is for reference