ATS-16G-84-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-16G-84-C1-R0-ND

Manufacturer Part#:

ATS-16G-84-C1-R0

Price: $ 3.77
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X35MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16G-84-C1-R0 datasheetATS-16G-84-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.42405
30 +: $ 3.23358
50 +: $ 3.04340
100 +: $ 2.85314
250 +: $ 2.66293
500 +: $ 2.47272
1000 +: $ 2.42517
Stock 1000Can Ship Immediately
$ 3.77
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.96°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are an essential component in many electronic components and systems. The ATS-16G-84-C1-R0 heat sink is a thermal device designed to keep components within the optimal thermal energy level and also optimize the performance of these components.

The ATS-16G-84-C1-R0 is a fanless heat sink design that utilizes a high thermal conductivity to dissipate heat away from the heat-generating components. These heat sinks are made of a combination of base metal and fin design that helps to optimize the cooling of the components. The thermal conductivity of the ATS-16G-84-C1-R0 heat sink is suitable for working temperatures of up to 125°C. The heat sinks feature efficient air-cooling without the need for fan-assisted cooling mechanisms such as Peltier devices.

The ATS-16G-84-C1-R0 heat sink is an ideal choice for components such as microprocessors, transistors, and other small electronic components. The heat sink is designed to provide effective cooling in an environment where space is limited. It is ideal for applications in a variety of fields, including medical systems, computer systems, automotive systems and military systems. It can also be used in robotic systems and in industrial processes. The heat sink can be used in an array of applications, from general cooling of heat-generating components to efficient cooling of specific components.

In addition, the surface of the ATS-16G-84-C1-R0 heat sink\'s fins is optimized for maximum efficiency, which allows the heat sinks to absorb heat from the component and efficiently dissipate it away. This helps to maintain the optimal temperature of the component and also to minimize the amount of energy wasted through the air. The ATS-16G-84-C1-R0 heat sink is a lightweight device that features small size and low weight, making it an ideal solution for cooling small components while occupying a minimal amount of space.

The ATS-16G-84-C1-R0 heat sink is also designed to be easy to install and can be used with any type of thermally conductive interface. The heat sink can also be used with active and passive heated elements. The device is designed to provide efficient cooling for components with a wide range of power ratings.

The ATS-16G-84-C1-R0 heat sink is a cost-effective and energy-efficient cooling system for the components that require a stable thermal environment. The high-efficiency fanless design ensures low energy consumption and also offers superior thermal performance. This heat sink is ideal for maintaining optimal operating temperatures for the components without the need for additional cooling systems and without sacrificing space or energy consumption.

The specific data is subject to PDF, and the above content is for reference

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