| Allicdata Part #: | ATS-16G-86-C3-R0-ND |
| Manufacturer Part#: |
ATS-16G-86-C3-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16G-86-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.33123 |
| 50 +: | $ 3.14622 |
| 100 +: | $ 2.96113 |
| 250 +: | $ 2.77603 |
| 500 +: | $ 2.68350 |
| 1000 +: | $ 2.40589 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important aspect of many industrial and commercial operations.Heat sinks are devices used to actively or passively dissipate heat generated by electronic components. The ATS-16G-86-C3-R0 is a heat sink designed to help regulate temperatures in thermally sensitive electronic systems.
The ATS-16G-86-C3-R0 features a black anodized aluminum body that is 16 mm thick and 86 mm wide. This aluminum construction is resistant to oxidation and corrosion. It is designed with an array of slits on the bottom of the heatsink, allowing for optimal air circulation and, in turn, efficient heat dissipation. Through the natural process of thermal conductivity, the heat generated by electronic chips and components is transferred to the metal fins of the ATS-16G-86-C3-R0.
The ATS-16G-86-C3-R0 is particularly useful in thermal applications, such as automotives, telecommunications, medical devices, computers, and power supplies. It can be used in a variety of systems that require proper thermal management, including those with high power consumption, those operating in extreme environmental conditions, and those involving high packing density.
The ATS-16G-86-C3-R0 is designed with a high level of thermal conductivity to efficiently transfer heat away from the components. The aluminum body has a high thermal conductivity of 117 BTUs/ft^2/hr/˚F, and the fins feature a black anodized aluminum finish that provides a low-contact resistance for maximum heat transfer.
Aside from designing an aluminum heatsink, the ATS-16G-86-C3-R0 includes a special heat sink compound that offers a conductive layer between the microprocessor and the heatsink. This additional layer of conductivity helps reduce the temperature of the microprocessor and prevents it from becoming overheated. There is also a thermally adhesive pad that helps dissipate heat away from other components that may be prone to overheating.
The ATS-16G-86-C3-R0 is also designed with a two-layer fixed structure that allows for optimal air flow and heat dissipation. The two-layer structure provides optimal performance in high-temperature environments and prevents the accumulation of dust and other debris. This feature also helps reduce noise and vibration.
The ATS-16G-86-C3-R0 is an efficient and reliable heat sink that can be used to effectively dissipate heat and protect thermally sensitive components. It has a high level of thermal conductivity and is designed with a two-layer fixed structure to ensure optimal air flow and effective heat dissipation. It is perfect for automotives, telecommunications, medical devices, computers, and power supplies that require thermal management.
The specific data is subject to PDF, and the above content is for reference