ATS-16G-97-C2-R0

Thermal - Heat Sinks are designed to dissipate the heat produced by electronic circuits and components. The ATS-16G-97-C2-R0 is a type of Thermal - Heat Sink that uses a combination of materials and construction to achieve the highest possible heat transfer efficiency.

Material Used

The material used in the ATS-16G-97-C2-R0 includes aluminum and copper. Copper offers excellent heat conductivity and is therefore the main material used for the body of the heat sink. Aluminum is used to finish the surface and protect the heat sink from corrosion and dust.

Design Features

The ATS-16G-97-C2-R0 features a unique fin array design that increases the surface area of the cooling fins, resulting in higher heat dissipation performance. The die-cast copper body is relatively thin and lightweight, allowing it to be used in tight, confined spaces without taking up too much space. In addition, the body has a unique flowing pattern to maximize the ability of air to freely flow through the fins for maximum cooling potential.

Construction and Construction Techniques

The ATS-16G-97-C2-R0 is composed of multiple components that are joined together using special techniques. The inner body is a copper alloy die-cast into a single piece, after which the fins are attached to the body using a soldering process. Each fin is forged into a specific shape to allow air to easily flow through them, and the fins are then soldered onto the copper body. Finally, an aluminum coating is used to finish the surface of the heat sink and protect it from dust and environmental exposure.

Mounting

The ATS-16G-97-C2-R0 is designed to be mounted directly to the electronic component, either through a hole or a threaded hole. This allows the heat sink to be easily and securely mounted to the component, allowing for maximum cooling performance.

Application Field

The ATS-16G-97-C2-R0 is designed to be used in a wide range of electronics, including microcontrollers, microprocessors, amplifiers, radio frequency and satellite electronics, telecommunications devices, industrial control systems, medical devices, and instrumentation. In addition, it can also be used in high-power electronic components such as servers and power supplies.

Working Principle

The working principle of the ATS-16G-97-C2-R0 is based on the transfer of heat from the electronic component to the heat sink. The heat is transferred through the metal components in contact with the component, from where it is then conducted through the copper body and dissipated into the air through the cooling fins. The aluminum finish prevents dust and debris from clogging up the surface of the heat sink and reducing its cooling performance.