Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.89°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

Thermal – Heat Sinks are important components in many electronic devices for heat dissipation. The ATS-16H-10-C2-R0 is a type of thermal-heat sink that is mostly used in small electronic items, such as cell phones, media players, mini-PCs, and gaming consoles. It is designed to meet the strict requirements for a range of different packaging needs as well as providing sufficient thermal protection for various components. This article will discuss the application fields and working principle of the ATS-16H-10-C2-R0.

Application Fields

The ATS-16H-10-C2-R0heat sink is commonly used in applications where the installation space is limited or the surrounding thermal environment is uncertain. It is capable of resisting high temperatures up to 179°F and is ideal for high-density electronic components that generate more heat. These components are generally found in cell phones, media players, mini-PCs, and gaming consoles. Additionally, the ATS-16H-10-C2-R0 is suitable for use in electronic products that require active and passive cooling elements which needs distributed volumes.

Working Principle

The ATS-16H-10-C2-R0 thermal-heat sink works by taking the heat away from the electronic components into the bulk heat capacity of the aluminum plate. This is done through natural convection or forced convection, depending on the design. In both cases, the heat generated by the electronic components is then removed from the sink by heat transfer media, such as air or liquid. The air is drawn to the sink and passed through carefully designed channels, which are designed to optimize the air velocity and reduce turbulence. The air then passes over the fins of the sink, where it picks up a layer of heat from the surface of the fins and transports it away. The air is then exhausted from the sink and the heat generated by the electronic components is dissipated by convection.The ATS-16H-10-C2-R0 thermal-heat sink can also be combined with a fan or other forced-air device for improved heat transfer. This is done by directly directing the flow of air over the surface of the fins or through channels. This increased air speed increases the cooling capacity of the heat sink, thus providing more effective cooling for the electronic components.

Conclusion

The ATS-16H-10-C2-R0 thermal-heat sink is an effective solution for the cooling of electronic components. It is suitable for installation in small space requirements, and is capable of removing large amounts of heat from components due to its aluminum plate construction. The sink has proven to be an efficient and economical solution for many electronic applications.

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