ATS-16H-12-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-16H-12-C1-R0-ND

Manufacturer Part#:

ATS-16H-12-C1-R0

Price: $ 3.48
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X12.7MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16H-12-C1-R0 datasheetATS-16H-12-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.16197
30 +: $ 3.07671
50 +: $ 2.90581
100 +: $ 2.73489
250 +: $ 2.56397
500 +: $ 2.47851
1000 +: $ 2.22211
Stock 1000Can Ship Immediately
$ 3.48
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.84°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The technology involved in thermal-heat sinks is one of the cutting edge fields of engineering. Many new applications of thermal-heat sinks have been explored, and the ATS-16H-12-C1-R0 is one of the most innovative of these. This device is designed to cool hot electronics from high temperatures to a safe level, ensuring the hardware does not get damaged due to excessive heat.

In order for the electrical components inside electronics to function properly, they must remain below a certain temperature. The ATS-16H-12-C1-R0 helps to reduce the heat generated by these components, which can decrease the wear of the systems or even cause failure. The device is able to do this by transferring heat away from the system and distributing it away from the hot electronics, allowing temperatures to remain below the maximum.

The ATS-16H-12-C1-R0 thermal-heat sink installs directly to the back of the integrated circuit board (PCB). This allows it to access the hotter areas of the hardware, such as where the internal electrical components are located. With a large enough sink, this heat can be spread away from the machine, possibly to a closed off room that is designed to keep the air inside at a certain temperature.

The thermal-heat sink will commonly use the heat pipes technology to transfer the heat away from the system. The heat pipe transfers heat from a higher temperature area to a lower temperature region, using phase change and evaporating fluid between the two. This works by the high temperature area heating up the fluid, which boils and converts to a vapor, and the vapor moves to the cooler region, absorbing the heat and condensing back to a liquid. This liquid flows back to the hot area, completing the cycle and continuously transferring the heat away from the machine.

The ATS-16H-12-C1-R0 is constructed from aluminum, providing an efficient heat sink with a wide surface area to transfer away the heat. Mounted on each side of the sink are heat pipes, which further distribute the heat away from the machine and the heat is transferred to the environment. To reach its maximum potential, the ATS-16H-12-C1-R0 uses a fan to drastically reduce the amount of time needed to cool the electronics.

The ATS-16H-12-C1-R0 is a highly efficient cooling solution for electronics in many different applications. It is a great tool for reducing and maintaining the temperature of hot components in electronics such as computers, game consoles, and even medical equipment. This thermal-heat sink is designed to run quietly and efficiently, allowing it to be embedded into a variety of machines and fields of application.

The specific data is subject to PDF, and the above content is for reference

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