ATS-16H-131-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS27831-ND

Manufacturer Part#:

ATS-16H-131-C2-R0

Price: $ 5.56
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X20MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16H-131-C2-R0 datasheetATS-16H-131-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 5.05260
10 +: $ 4.91589
25 +: $ 4.64285
50 +: $ 4.36968
100 +: $ 4.09658
250 +: $ 3.82347
500 +: $ 3.55036
1000 +: $ 3.48209
Stock 1000Can Ship Immediately
$ 5.56
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.60°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks

A heat sink is an important component used to keep components and systems from overheating. Heat sinks are used in applications as varied as consumer electronics, medical equipment, and aerospace components. The ATS-16H-131-C2-R0 is a type of heat sink specifically designed for use in high-temperature applications.

The ATS-16H-131-C2-R0 is an aluminum extruded heat sink that is designed to dissipate heat generated by components such as LEDs, CPUs, GPUs, RF transceiver chips and other high-temperature applications. It features an open air design with no need for fans or other active cooling methods, allowing for optimal thermal performance.

The ATS-16H-131-C2-R0 has a number of features that make it ideal for high-temperature applications. It features high thermal conductivity and low thermal resistance, ensuring high performance and maximum heat transfer efficiency. The aluminum body also provides excellent corrosion resistance and excellent electrical insulation.

The working principle of the ATS-16H-131-C2-R0 heat sink is based on the principle of natural convection. The heat generated by the components is absorbed by the fins of the heat sink. This heat is then moved away from the hot area, through the wider fins and by the fan-less design, allowing for optimal thermal performance. The open air design allows air to flow more freely, and at higher velocities, increasing the efficiency of the thermal transfer.

The ATS-16H-131-C2-R0 is designed for high-temperature applications where maximum cooling is required. It has been designed to be used in a variety of applications such as telecommunications, automotive, and aerospace components. It can be used in both high-power and low-power applications with thermal performance efficiency.

The ATS-16H-131-C2-R0 is a suitable choice for applications that need robust thermal management in extreme temperature environments. It is designed to provide high performance, optimal thermal transfer efficiency, and superb reliability in extreme temperature application fields. The open air design provides maximum thermal performance in high-temperature environments.

The specific data is subject to PDF, and the above content is for reference

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