
Allicdata Part #: | ATS-16H-146-C3-R0-ND |
Manufacturer Part#: |
ATS-16H-146-C3-R0 |
Price: | $ 3.89 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 30X30X35MM L-TAB T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.53934 |
30 +: | $ 3.34278 |
50 +: | $ 3.14622 |
100 +: | $ 2.94953 |
250 +: | $ 2.75290 |
500 +: | $ 2.55626 |
1000 +: | $ 2.50711 |
Specifications
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.181" (30.00mm) |
Width: | 1.181" (30.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.378" (35.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 4.21°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Description
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Introduction
Thermal - Heat Sinks are basically designed to dissipate the heat coming out of an electronic device. The ATS-16H-146-C3-R0 is a type of heat sink which is specifically designed to provide an optimal cooling effect. This type of heat sink is used in the majority of electronic devices, ranging from personal computers to video game consoles as well as audio and video equipment. It is incredibly versatile due to its ability to transfer heat from one device to another, allowing for a cool, comfortable environment in any electronic system.Application Field
The ATS-16H-146-C3-R0 has been used in a wide variety of applications since it first debuted. It has been used in computers, audio and video equipment, communications systems, and military and aerospace systems, as well as gaming systems. Its ability to transfer heat efficiently has made it incredibly popular in high-performance applications, particularly those that require extremely large amounts of power to operate.The wide range of applications that the ATS-16H-146-C3-R0 can be used in is due to the type of cooling system it features. This type of heat sink is designed with a fin-based design which allows it to efficiently draw heat away from the device and disperse it into the air. The fin design ensures that air can easily flow around the heat sink, providing for highly effective cooling.Design Features
The ATS-16H-146-C3-R0 is a very advanced heat sink design that incorporates several features to increase its performance and efficiency. These features include a low-profile design, a high thermal conductivity, and a robust construction. The low-profile design means that the ATS-16H-146-C3-R0 heat sink can be incorporated into almost any type of electronic device without taking up too much space. This is very helpful in applications where space is at a premium.The high thermal conductivity of the ATS-16H-146-C3-R0 also ensures that heat can quickly and effectively be dissipated away from the device, preventing it from becoming too hot and potentially causing damage. This makes it an ideal choice for high-performance applications.Finally, the construction of the ATS-16H-146-C3-R0 is also designed to be robust and reliable. The fins are constructed from aluminum which has been designed to withstand extreme temperatures and resist corrosion, ensuring that the heat sink will remain in good condition even after extended periods of use.Working Principle
The ATS-16H-146-C3-R0 heat sink works on the principle of convection. The fins on the heat sink are designed to create a large surface area which can heat up quickly when exposed to a large heat source. This heated air then rises above the heat sink and is replaced by cooler air, which in turn takes away heat from the fins. This process of convection creates a constant circulation of air around the heat sink which keeps the device at a cool temperature.In addition to convection, the ATS-16H-146-C3-R0 heat sink also utilizes a technique known as “heat spreading.” Heat spreading is a process by which the heat from one device is distributed among multiple devices. This ensures that heat is evenly spread throughout the entire system, preventing any single device from becoming too hot and potentially causing damage.Conclusion
As we can see, the ATS-16H-146-C3-R0 is a highly advanced heat sink that is designed to provide an optimal cooling effect. Its low-profile design, high thermal conductivity, and robust construction make it an ideal choice for high-performance applications. Additionally, its use of convection and heat spreading techniques ensure that heat is spread evenly throughout the system. Overall, the ATS-16H-146-C3-R0 is an ideal solution for anyone who needs efficient cooling for their device.The specific data is subject to PDF, and the above content is for reference
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