| Allicdata Part #: | ATS-16H-153-C3-R0-ND |
| Manufacturer Part#: |
ATS-16H-153-C3-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16H-153-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.55131 |
| 30 +: | $ 3.35370 |
| 50 +: | $ 3.15643 |
| 100 +: | $ 2.95917 |
| 250 +: | $ 2.76189 |
| 500 +: | $ 2.56462 |
| 1000 +: | $ 2.51530 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an important part of the modern cooling system. The ATS-16H-153-C3-R0 is a heat sink specifically designed to provide efficient cooling to electronic components in a wide variety of applications. In the following article, we will discuss the application field and working principle of the ATS-16H-153-C3-R0.
The ATS-16H-153-C3-R0 can be used in both industrial and commercial applications. The device is designed to dissipate heat that has built up from the operational processes of machinery, computers and other electronic systems. It can also be used in medical and laboratory applications where the thermal management of delicate electronic systems is critical. The heat sink is capable of dissipating heat from a wide range of components including CPUs, GPUs, memory chips, and integrated circuits.
The ATS-16H-153-C3-R0 is a single-side heat sink, meaning it is a single-piece device built to dissipate the heat created by various electronic components. The device is composed of aluminum fins and copper rods, which are combined to create the structure of the heat sink. The aluminum fins of the device are arranged in a wave-like pattern and are designed to maximize the cooling area of the device. This type of design helps to maximize the cooling performance of the device.
The heat sink operates by absorbing heat from the electronic components and dissipating it into the surrounding environment. The heat sink is designed to allow the air to flow freely across the fins, thereby improving the cooling performance of the device. The fins are usually arranged in a staggered pattern, so the airflow can be directed over the fins in order to maximize the cooling capabilities of the heat sink. Additionally, the device is able to accommodate different fan speeds, allowing for more precise cooling of the components.
The ATS-16H-153-C3-R0 heat sink is designed to be highly reliable and durable. Its construction is intended to withstand exposure to high temperatures and heavy loads. This ensures that the device will last longer and perform reliably in any application. Furthermore, its design allows for efficient cooling in a wide variety of applications, making it a versatile and reliable cooling solution.
In conclusion, the ATS-16H-153-C3-R0 is an ideal heat sink for a variety of applications. It is a single-piece device that is great for dissipating heat away from electronic components. The device is composed of aluminum fins and copper rods that provide a high level of cooling efficiency. The device is designed to be reliable and long-lasting, and its design allows for efficient cooling in nearly any application. This makes the ATS-16H-153-C3-R0 a great choice for cooling delicate electronic components.
The specific data is subject to PDF, and the above content is for reference