ATS-16H-154-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.51°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

Heat sinks are efficient secondary heat transfer components designed to dissipate or remove heat from electronic components. They are essential tools for companies and research institutions developing application projects involving the use of circuit components. This article will discuss the application fields and working principles of the ATK-16H-154-C2-R0 heat sink.The ATK-16H-154-C2-R0 heat sink is composed of a core element and up to four surrounding fins attached to the sides of the core. The core element is designed to effectively absorb heat away from the PCB, making it the ideal piece for dissipating heat generated by many high-end electronic components. The fins of the heat sink are designed to provide additional heat dissipation surfaces, thus allowing for greater heat transfer to the surrounding air.The key application fields for the ATK-16H-154-C2-R0 heat sink include the development of cooling miscellaneous integrated circuit (IC) packages, as well as the cooling of high density processors and discrete circuit components with high current and power dissipation capabilities. Since the core element and fins of the heat sink make use of modern convective cooling techniques, the device is able to dissipate heat at a faster rate than traditional solution based on the rule of radiation-based heat dissipation techniques.The working principle of the ATK-16H-154-C2-R0 thermal heat sink is simple and straightforward. Heat generated by the circuit is absorbed by the core element and then dissipated to the outside environment by convection. The fins of the heat sink act as convection mediums, allowing for the transfer of heat to the surrounding air. The fins also help to reduce the amount of direct contact between the heat sink and the ambiance, thus further increasing the cooling efficiency.Also, the ATK-16H-154-C2-R0 heat sink utilizes a special built-in mechanism that ensures a proper contact between the heat sink and the target device. This mechanism also serves to reduce thermal resistance, resulting in improved cooling performance. The device also takes advantage of a unique interlocking escutcheon system to ensure correct alignment and installation of the heat sink on the printed circuit board.The ATK-16H-154-C2-R0 heat sink is a powerful tool that can be utilized to effectively dissipate heat generated by high end electronic components. Its key application areas include the cooling of integrated circuit packages, high density processors, and discrete components having high current and power dissipation capability. Its distinctive design ensures a snug fit and reliable contact with the target device, reducing the amount of material-based thermal resistance. Thanks to the interlocking escutcheon system, the device is also easy to install and align.

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