ATS-16H-161-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.74°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-16H-161-C2-R0 Thermal - Heat Sinks

The ATS-16H-161-C2-R0 (herein referred to as the ATS) is a convection-cooled, aluminum finned heat sink designed to provide reliable thermal management of electronic components. This thermal - heat sink offers robust thermal performance in a rugged and reliable package that can be applied universally to any heatsink material type.

Application Field

The ATS-16H-161-C2-R0 is designed for use in a wide range of applications, including power supply thermal management, high-performance computing, and medical and industrial electronics. Its lightweight, low-profile design offers excellent thermal dissipation abilities in an efficient, cost-effective package. The ATS is compatible with most standard commercial and industrial cooling systems, such as fans, pumps, and heat exchangers. Additionally, the ATS-16H-161-C2-R0 can also be used as a heatsink for other high-heat applications, such as LED lighting systems or resistors.

Design and Construction

The ATS-16H-161-C2-R0 is a finned aluminum heat sink, and has been designed to be highly efficient in dissipating heat from electronic components. The heat sink is composed of a number of aluminum fins with a grooved pattern, allowing for increased surface area and a larger surface area for the heat to dissipate. Additionally, the thermal - heat sink has a hollow core, which allows for increased heat dissipation. The overall construction of the ATS ensures that the heat can be efficiently dissipated from the surface, allowing for greater thermal performance.

Performance

The ATS-16H-161-C2-R0 is designed to be a highly efficient heat sink, and its robust thermal performance makes it an ideal choice for a variety of applications. The thermal - heat sink can provide an effective thermal management solutions for high-powered devices, as well as providing cooling for a variety of industrial and consumer electronics. The ATS-16H-161-C2-R0 is capable of dissipating up to 10W of power, and has a temperature range of -22°F (-30°C) to +122°F (+50°C). Additionally, the thermal - heat sink is designed to dissipate heat quickly and evenly across the entirety of its surface area.

Working Principle

The ATS-16H-161-C2-R0 utilizes a convection-cooling system to dissipate heat. This system uses the natural convection of air to draw away the heat from the electronic components as well as the ATS-16H-161-C2-R0 itself. The fins of the ATS allow for an increased surface area to improve the rate of heat dissipation, and the hollow core allows air to move freely around the fins, dissipating the heat quickly and uniformly. The ATS-16H-161-C2-R0 can be used in conjunction with other cooling solutions, including fans, pumps, and heat exchangers, to further enhance thermal performance.

Conclusion

The ATS-16H-161-C2-R0 thermal - heat sink is an efficient and reliable solution for thermal management of electronic components. Its lightweight, durable design makes it an ideal choice for a variety of applications, including power supply thermal management, high-performance computing, and medical and industrial electronics. The ATS-16H-161-C2-R0 can dissipate up to 10W of power and has a temperature range of -22°F (-30°C) to +122°F (+50°C). Additionally, its convection-cooling system ensures an effective and uniform heat dissipation across its entire surface.

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