| Allicdata Part #: | ATS-16H-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-16H-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-16H-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential to ensure that electronic components remain within the prescribed operating temperature. Heat sinks are used to dissipate heat from electronic components, attempting to regulate their internal temperature to remain within the limits given by the manufacturer. The ATS-16H-20-C1-R0 is a heat sink specifically designed to quickly transfer the heat away from the device.
The ATS-16H-20-C1-R0 operates with an anodized aluminum oxide-finished heat-conducting surface. The active area is stamped in the metal body and maximized with the use of a curved fin design, increasing the total surface area and hence increasing the efficiency of the heat sink. The fins also increase air circulation and cooling performance when placed in a fan-cooled environment, providing additional cooling performance. ATS-16H-20-C1-R0 is applied to cool components down to temperatures as low as 10°C and as high as 95°C. That allows it to be used in a wide range of industrial and consumer applications, even operating directly in vacuum or in corrosive atmospheres.
The ATS-16H-20-C1-R0 provides higher heat dissipation than other air-cooled heat sink products. It will dissipate over 20 W in a free convection environment. This powerful performance allows the ATS-16H-20-C1-R0 to be used in the most demanding applications such as CPUs and GPUs, ensuring that the device remains within the manufacturer’s specified limits. In addition, its curved fin design reduces air resistance, which ensures lower air temperatures when placed in a fan-cooled environment.
The ATS-16H-20-C1-R0 has a wide range of applications, from the consumer and consumer electronics sectors to the industrial sector. It is ideal for controlling heat in CPUs, GPUs, and other large-scale components like automotive electronics, power supplies, and server racks, just to name a few. In addition, its quick heat transfer prevents the components from overheating, thus preventing damage and prolonging the life of the components.
The ATS-16H-20-C1-R0 also features an advanced thermal management technology and is compliant with UL, RoHS, and CE standards. This means that the product is designed to meet the highest industrial standards and can be used in a wide range of commercial and industrial applications. This also ensures the safety of the components, thus eliminating the risk of harm to personnel and equipment.
The ATS-16H-20-C1-R0 is a versatile heat sink that can be used in a wide range of applications and is ideal for controlling the temperatures of power-hungry components. Its efficient curved fin design and high-grade aluminum construction provide effective heat dissipation, ensuring reliable performance in the harshest of environments. With its advanced thermal management technology, it is compliant with stringent industry standards, providing users with a safe and reliable solution.
The specific data is subject to PDF, and the above content is for reference
ATS-16H-20-C1-R0 Datasheet/PDF