| Allicdata Part #: | ATS27906-ND |
| Manufacturer Part#: |
ATS-16H-20-C2-R0 |
| Price: | $ 4.98 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16H-20-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.52970 |
| 10 +: | $ 4.40685 |
| 25 +: | $ 4.16203 |
| 50 +: | $ 3.91734 |
| 100 +: | $ 3.67246 |
| 250 +: | $ 3.42763 |
| 500 +: | $ 3.18280 |
| 1000 +: | $ 3.12159 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.14°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sink are a technology used in many applications to aid in the transfer of thermal energy. The ATS-16H-20-C2-R0 heat sink, produced by Advanced Thermal Solutions, Inc. is an aluminum heat sink with a thermally conductive polyurethane and film laminate on one side. It is a long-term reliable thermal solution, which has been used for years in a variety of industries.
The most common application of the ATS-16H-20-C2-R0 heat sink is in electronics cooling. It can be used to cool components in computer systems, circuit boards, amplifiers, communications systems, and power supplies. The heat sink’s thermally conductive polyurethane and film laminate allows it to be used effectively in any type of environment, general or extreme, and it will not corrode due to ultra-violet radiation. Additionally, the heat sink has a low noise signature and an overall low profile.
The working principle behind the ATS-16H-20-C2-R0 heat sink is simple. Heat is generated from the electronic components it is used to cool. The heat is transferred into the heat sink via its thermally conductive polyurethane and film laminate. The heat is then dissipated through the heat sink’s efficient fin design. The combination of the polyurethane and laminate, along with the efficient fin design, result in maximum heat transfer and therefore temperature control.
The ATS-16H-20-C2-R0 heat sink is a reliable thermal solution for any application where electronics cooling is a factor. Its efficient fin design allows for maximum heat transfer, resulting in lower operating temperatures and greater reliability and performance. Its thermally conductive polyurethane and film laminate ensures it can be used in the toughest environments without any corrosion. The combination of these factors, in addition to its low noise signature and low profile, make the ATS-16H-20-C2-R0 a viable, long-term thermal solution.
The specific data is subject to PDF, and the above content is for reference