| Allicdata Part #: | ATS-16H-26-C1-R0-ND |
| Manufacturer Part#: |
ATS-16H-26-C1-R0 |
| Price: | $ 5.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16H-26-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.08914 |
| 30 +: | $ 4.80669 |
| 50 +: | $ 4.52390 |
| 100 +: | $ 4.24116 |
| 250 +: | $ 3.95842 |
| 500 +: | $ 3.67567 |
| 1000 +: | $ 3.60499 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.19°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-16H-26-C1-R0 is a kind of thermal heat sink used in many industries. It is a device used to dissipate the heat generated by electronic components. Heat sinks are usually made from a heat dissipating material such as aluminum or copper and are designed in various shapes, sizes, and configurations.
The ATS-16H-26-C1-R0 heat sink has a large thermal application field. It is used in various types of power electronics, such as rectifiers, switched-mode power supplies (SMPS), motor speed controllers, and other power electronic components. It is also widely used in consumer electronic products, such as computers, mobile phones, and other electronic equipment. It is also used in LEDs, optoelectronics, and other heat sensitive devices.
The ATS-16H-26-C1-R0 heat sink works according to the principles of thermal conductivity and convection. The heat generated by the electronic components is transferred to the heat sink through thermal conduction, and the heat sink absorbs and dissipates the heat by convection. The air around the heat sink is heated by the heat sink and then dissipates away from the heat sink. This process helps to maintain the temperature of the electronic components at an optimal level. The heat transfer occurs more efficiently when the air around the heat sink is significantly cooler than the heat sink itself, which helps to reduce power consumption.
The ATS-16H-26-C1-R0 heat sink offers superior thermal performance and good reliability. It has an anodized aluminum body with high fin density, which ensures excellent heat transfer and does not rust. It is lightweight and robust, with good thermal conductivity, easy installation and maintenance. The heat sink also features a long life span, low power consumption, and low wind noise. With its superior thermal performance and reliability, the ATS-16H-26-C1-R0 is an ideal choice for a wide range of applications.
In summary, the ATS-16H-26-C1-R0 heat sink is a great choice for a wide range of applications. It has a wide thermal application field, and its working principle is based on the transmission of thermal energy and convection. It offers superior thermal performance and good reliability, as well as low power consumption, easy installation, and maintenance. With its superior thermal performance and reliability, the ATS-16H-26-C1-R0 is an ideal choice for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference