ATS-16H-30-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-16H-30-C1-R0-ND

Manufacturer Part#:

ATS-16H-30-C1-R0

Price: $ 7.36
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16H-30-C1-R0 datasheetATS-16H-30-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 6.62760
30 +: $ 6.25947
50 +: $ 5.89138
100 +: $ 5.52315
250 +: $ 5.15494
500 +: $ 4.78673
1000 +: $ 4.69468
Stock 1000Can Ship Immediately
$ 7.36
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal materials, such as heat sinks, are used to reduce the temperature of any device. Heat sinks are usually attached to components such as chips or processors in computers, in order to dissipate the heat generated by these components. The ATS-16H-30-C1-R0 is one such heat sink. It is a high-performance heat sink, designed for use in industrial settings where heat dissipation is critical.

The ATS-16H-30-C1-R0 has a number of features that make it ideal for use in industrial applications. First, it is constructed from aluminum, which is a strong and durable material. This makes it the perfect choice for industrial applications, where it is likely to be exposed to a wide range of variables, such as temperature variations and other environmental factors. Additionally, the aluminum construction helps to ensure that the heat sink will remain efficient over long periods of time.

The ATS-16H-30-C1-R0 is also designed with an air-cooling system that helps to ensure that any generated heat is quickly dispersed. This cooling system makes use of the natural convective cooling effect, whereby heated air is moved away from the component it is attached to, allowing the air to cool more quickly and efficiently. The air-cooling system also helps to maximize the performance of chips or processors that the heat sink is attached to, as it can keep them cool for longer periods of time and reduce the risk of them becoming overheated.

The ATS-16H-30-C1-R0 is also designed with a series of copper fins that are closely positioned around the aluminum base. This design helps to increase the surface area of the heat sink, which means that more heat can be dissipated from the component it is attached to. By increasing the surface area, the heat sink also maximizes its thermal efficiency, allowing it to cool components faster and more efficiently than other heat sinks.

Another important feature of the ATS-16H-30-C1-R0 is its excellent heat transfer capability. The copper fins and aluminum base have exceptional thermal conductivity, which means that heat is quickly and efficiently transferred away from the component, helping to ensure that it stays cool even under demanding conditions. This heat transfer ability also helps to increase the lifespan of the component, as it will not be subjected to excessive amounts of heat for prolonged periods of time.

In summary, the ATS-16H-30-C1-R0 is an excellent heat sink for use in industrial applications. Its aluminum construction makes it durable and reliable, while its air-cooling system and copper fins help to ensure that it can quickly dissipate heat from its attached components. Additionally, its excellent heat transfer ability helps to increase the lifespan of the component, allowing it to remain functional even under high temperatures. As such, the ATS-16H-30-C1-R0 is an ideal choice for any industrial application that requires efficient heat dissipation.

The specific data is subject to PDF, and the above content is for reference

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