| Allicdata Part #: | ATS-16H-73-C1-R0-ND |
| Manufacturer Part#: |
ATS-16H-73-C1-R0 |
| Price: | $ 3.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16H-73-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important aspect of electrical and electronic engineering. Heat sinks are one of the most common methods of cooling electronic components, and the ATS-16H-73-C1-R0 is one such device.
This heat sink is designed to remove heat from electrical components, helping to maintain optimal operating temperatures. It can be used for a variety of applications, including medical equipment, military and aerospace equipment, defense and transportation systems, broadcasting systems, consumer electronics, computers and embedded systems. The ATS-16H-73-C1-R0 can also be used in industrial applications, such as process control systems, industrial automation equipment, and HVAC systems.
The ATS-16H-73-C1-R0 heat sink is constructed from high-thermal-conductivity aluminum and employs a construction technique that ensures a high level of thermal performance. The device features a compact design that allows it to fit into many applications, including tight spaces. The heat sink is optimized for air flow, and its unique design helps to ensure that the airflow is optimized for the most efficient cooling.
The ATS-16H-73-C1-R0 heat sink employs a variety of technologies to maximize its effectiveness. It features fins that have an optimized profile and surface area to ensure maximum heat dissipation. In addition, the device uses an array of wicking surfaces to aid in heat transfer and absorption. The heat sink also features active cooling capabilities, allowing it to adjust the cooling according to the specific application needs.
The device has a robust design that ensures it is able to withstand extreme conditions. It features advanced corrosion protection and has been tested to withstand temperatures up to 200°C (392°F). The heat sink is also designed to be resistant to dust, dirt, and other environmental contaminants. The heat sink also features a wide operating temperature range of -55°C (-67°F) to +200°C (+392°F).
The ATS-16H-73-C1-R0 heat sink is easy to install and requires minimal maintenance. The device is designed to mount directly onto the device it is cooling and requires simple connections for power and data. In addition, the heat sink is equipped with mounting tabs for easy installation and removal. The device also features a high-efficiency design that ensures maximum cooling performance.
Overall, the ATS-S6H-73-C1-R0 heat sink is an effective and reliable tool for managing thermal performance in a variety of applications. It is designed to provide reliable cooling performance with minimal maintenance and energy consumption. The device’s small size and lightweight design make it ideal for a variety of applications, and its corrosion-resistant and dust-proof design ensure its long-term reliability. The device is also designed to be easy to install and simple to maintain, making it a cost-effective solution for cooling electronics in a variety of applications.
The specific data is subject to PDF, and the above content is for reference