
Allicdata Part #: | ATS-16H-79-C3-R0-ND |
Manufacturer Part#: |
ATS-16H-79-C3-R0 |
Price: | $ 3.48 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 30X30X10MM R-TAB T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.16197 |
30 +: | $ 3.07671 |
50 +: | $ 2.90581 |
100 +: | $ 2.73489 |
250 +: | $ 2.56397 |
500 +: | $ 2.47851 |
1000 +: | $ 2.22211 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.181" (30.00mm) |
Width: | 1.181" (30.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 26.55°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal – Heat Sinks are used to help reduce heat temperatures in a variety of electrical and electronic systems. The ATS-16H-79-C3-R0 is a particular heat sink that is specially designed and manufactured to help in dissipating heat generated from the junction between two circuit boards, components, or basic electrical systems. It is one of the most advanced and reliable heat sinks available in the market and features a low profile, frosted aluminum surface, and a compact profile allowing it to fit perfectly in the area it is fitted in.
The ATS-16H-79-C3-R0 heat sink is mainly used in applications and systems that need to generate and dissipate heat quickly and efficiently. This type of heat sink helps in improving the reliability and performance of the systems, with efficient heat dissipation. Some of the applications of this heat sink include in high power electrical systems, computers, microprocessor cooling systems, medical and military applications where space is limited, and industrial computers.
Being a modern heat dissipating system, the ATS-16H-79-C3-R0 uses a variety of technologies to help in efficient heat dissipation. The most important of these technologies is the combination of active and passive thermal control systems to ensure consistent temperatures all through the system. Active thermal control systems help in regulating the power output of components while passive systems help with convective heat transfer from body surfaces. By combining active and passive systems, the ATS-16H-79-C3-R0 is able to dissipate heat at a much faster rate than traditional methods.
The ATS-16H-79-C3-R0 also features a unique Nano Dendritic Process (NDPro) technology, which helps maximize heat transfer by utilizing a dendritic pattern of heat conduction fins, embedded in the surface of the heat sink. This dendritic pattern also helps in reducing the overall weight of the heat sink, which in turn reduces air resistance and allows for a more efficient cooling effect. The dendritic pattern allows the ATS-16H-79-C3-R0 to dissipate heat more quickly and efficiently than similar heat sinks without the NDPro technology.
Another important feature of the ATS-16H-79-C3-R0 is its ability to improve the temperature rating of the system. Unlike traditional heat sinks, which require a flat surface and lower temperatures, this heat sink has the ability to dissipate heat over a wide range of temperatures. It is also able to handle lower and higher temperature gradients without much difficulty. Thanks to its NDPro technology, the ATS-16H-79-C3-R0 is able to provide superior heat dissipation and a longer operational life span compared to most other heat sinks.
Overall, the ATS-16H-79-C3-R0 is an extremely reliable and versatile heat sink. Thanks to its advanced technologies, efficient heat dissipation capabilities, and improved temperature rating, the ATS-16H-79-C3-R0 heat sink is well-suited for a variety of applications and systems that require heat dissipation and a greater operational life span. Heat sinks of this type are especially suited for high power systems, military and aerospace applications, and other electronic systems where space is limited.
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