| Allicdata Part #: | ATS-17A-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-17A-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17A-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important element of many industrial applications, and the use of heat sinks is an effective way for designers to manage systems temperature levels and ensure optimal product performance and reliability. The ATS-17A-117-C1-R0 is a type of heat sink that is designed to help dissipate heat generated by electrical systems. These heat sinks can be used in a variety of applications, including in power electronics, computer mainboards, and supports for LED lighting.
The ATS-17A-117-C1-R0 is designed to offer maximum cooling performance for applications requiring high-heat dissipation capabilities. It features a design with large heatsink fins for maximum surface area, which maximizes the ability of the sink to dissipate heat. It also features a design that uses thermal compound within its base to ensure that heat is transferred from the component to the heat sink efficiently. This ensures good thermal performance and an even heat distribution.
The ATS-17A-117-C1-R0 is constructed with aluminum fins that are soldered together, giving it excellent thermal durability and strength. The fins are also electroplated to provide a durable and corrosion-resistant surface. Additionally, the heat sink is designed for easy installation and user friendliness, making it a great choice for those with limited or no experience in thermal management.
One application in which the ATS-17A-117-C1-R0 can be used is in automotive electronics. Automotive electronics generate a large amount of heat due to higher-power electrical components, making it a prime target for thermal management. TheAATS-17A-117-C1-R0 features large heatsink fins for maximum dissipating power, which makes it an ideal choice for automotive electronics. The heat sink\'s ability to be bolted or clipped on to the component also allows for easy installation, which is important in today\'s time-sensitive automotive industry.
The ATS-17A-117-C1-R0 also works well in IT and communications applications. These systems, which also produce a large amount of heat, can benefit from the ATS-17A-117-C1-R0\'s low profile design. TheAATS-17A-117-C1-R0 is designed to easily fit within the confined spaces of IT and communications equipment, which is beneficial for allowing for maximum airflow. This ensures efficient dissipation of heat from within the system, and allows for higher performance and efficiency.
The ATS-17A-117-C1-R0 is an effective heat sink designed to offer maximum cooling performance and thermal management capabilities. It features a large surface area provided by its finned design, as well as a durable aluminum construction with electroplated finish. TheAATS-17A-117-C1-R0 can be easily mounted and is suitable for use in a variety of applications, such as automotive electronics, IT and communications systems, and LED lighting. Through its efficient thermal management capabilities and durable construction, the ATS-17A-117-C1-R0 is an ideal choice for those needing reliable thermal performance in their applications.
The specific data is subject to PDF, and the above content is for reference