ATS-17A-12-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	15.84°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal-heat sinks are important components of many electronics systems, providing effective management of heat transfer between different components and the environment. The ATS-17A-12-C1-R0 thermal heat sink is an advanced solution designed for use in a wide range of thermal applications. This heat sink combines a unique design with special features, offering superior thermal performance in a small footprint.

Design and Construction

The ATS-17A-12-C1-R0 thermal heat sink is constructed with high quality extruded aluminum. It has an ultra-thin design, measuring 17mm x 1.2 mm. The heat sink is then machined to precise specifications to maximize thermal performance. The advanced design is based on the principle of natural convection, with channels within the heat sink conduct air from warm to cold airflow chambers. To facilitate natural convection, the heat sink has a finned top to maximize surface area.

Thermal Performance

The ATS-17A-12-C1-R0 thermal heat sink has an impressive thermal performance rating. Its unique design and construction allows the heat sink to operate as efficiently as possible. In fact, when tested against standard aluminum heat sinks, the ATS-17A-12-C1-R0 was able to transfer more than 20% more heat. That translates into more efficiency, as the heat sink is able to dissipate more heat in a given time.

Typical Applications

The ATS-17A-12-C1-R0 thermal heat sink is ideal for use in a wide range of applications, including telecommunications, automotive, consumer electronics, and medical. It can be used to cool various components, such as microprocessors, power switching components, diodes, and regulators. Additionally, the heat sink is well-suited for industrial equipment and applications that require higher operating temperatures.

Conclusion

The ATS-17A-12-C1-R0 thermal heat sink is a superior solution for thermal management in a wide range of applications. Its advanced design and construction combine to create a heat sink that is highly efficient and capable of dissipating more heat than conventional aluminum heat sinks. Its thin design allows for use in a variety of applications, and its high thermal performance makes it an ideal choice for any electronics system.

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