ATS-17A-134-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS28032-ND

Manufacturer Part#:

ATS-17A-134-C2-R0

Price: $ 7.32
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X15MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17A-134-C2-R0 datasheetATS-17A-134-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 6.58350
10 +: $ 6.40773
25 +: $ 6.05203
50 +: $ 5.69596
100 +: $ 5.34001
250 +: $ 4.98401
500 +: $ 4.62801
1000 +: $ 4.53900
Stock 1000Can Ship Immediately
$ 7.32
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.44°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are used in a variety of applications where the goal is to dissipate the heat generated by a device, circuit, or heat source. Heat sinks are an essential component of any cooling system, and can help reduce operating temperatures, as well as extend the life of parts and components. ATS-17A-134-C2-R0 is a thermal heat sink designed for applications that require efficient heat dissipation.

This thermal heat sink is made of aluminum. It features a series of fins to maximize surface area and to increase the speed of heat dissipation. It has a simple design; heat from the device, circuit, or heat source is transferred to the heat sink via direct contact. The heat sink captures the heat and then dissipates it as heat energy is converted into thermal energy, and moved away from the device. The longer the fins, the more heat will be dissipated from the heat sink. The ATS-17A-134-C2-R0 is designed to provide superior cooling performance; it has a thermal resistance rating of 0.13°C/W, and is capable of cooling components up to 150°C.

This thermal heat sink is designed for use with various electronic components, such as ASICs, FPGAs, and CPUs. The ATS-17A-134-C2-R0 is easy to install and maintain; it can be mounted on a variety of surfaces, including PCs, panels, and other electronic assemblies. Additionally, the heat sink is designed to be low-profile, allowing it to fit into tight spaces when necessary. It also features a lightweight and compact design, making it an ideal choice for small, portable devices.

The ATS-17A-134-C2-R0 thermal heat sink is an ideal solution for applications that require efficient heat dissipation. Its lightweight design, high thermal resistance rating, and easy installation and maintenance make it a great choice for any application that requires effective heat dissipation. It is an excellent choice for cooling down electronics and other components, and is sure to provide reliable and efficient cooling performance for many years to come.

The specific data is subject to PDF, and the above content is for reference

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