ATS-17A-163-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-17A-163-C1-R0-ND

Manufacturer Part#:

ATS-17A-163-C1-R0

Price: $ 3.86
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X30MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17A-163-C1-R0 datasheetATS-17A-163-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.50469
30 +: $ 3.31002
50 +: $ 3.11535
100 +: $ 2.92062
250 +: $ 2.72591
500 +: $ 2.53120
1000 +: $ 2.48253
Stock 1000Can Ship Immediately
$ 3.86
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.88°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a key aspect of machinery operation in any industry. One of the essential tools used for regulating temperature is the heat sink. Heat sinks are responsible for dissipating heat away from critical components, protecting them from potential damage or degrading performance due to excessive heat.

The ATS-17A-163-C1-R0 heat sink is a high performance device designed for computer systems. It features aluminum fins that are arranged in a grid structure that increases the surface area in contact with the air, allowing the heat sink to disperse heat more efficiently. The fins are also designed with air channels in between, which allows air to flow through the fins and effectively dissipate heat more quickly. This design significantly reduces thermal resistance, and improves overall system performance by reducing the load on critical components.

The ATS-17A-163-C1-R0 features a copper base covered with a nickel-plated coating. Copper is an extremely efficient heat conductor, so it is ideal for heat sinks that need to dissipate heat quickly. The nickel plating ensures that the heat sink is corrosion-resistant and durable, so it can withstand heavy use in demanding applications. The device is also lightweight and easy to install, making it an ideal choice for applications where space is limited or hard to reach.

The ATS-17A-163-C1-R0 is primarily used in applications with high thermal loads such as servers, HPC systems, and industrial systems. It can be used to replace bulky air-cooled systems that are prone to overheating, and can help keep energy costs down by reducing cooling requirements. This heat sink can be used to cool CPUs, GPUs, circuitry, or other components in a system that may be prone to overheating.

The main working principle of the ATS-17A-163-C1- R0 is thermal convection. Heat is absorbed by the heat sink from the component and dissipated into the air through the fins. The air is drawn in from the side of the device via vents, and the fins facilitate the efficient transfer of heat away from the component. This process creates a cycle of air circulation that helps to keep thermal loads in check and prevents overheating.

The ATS-17A-163-C1-R0 is an efficient thermal management solution for applications with high thermal loads. It is compact and lightweight, and its innovative design allows it to effectively dissipate heat quickly and keep components running at optimal temperatures. This heat sink is an ideal choice for systems in a wide range of industries, and its performance and durability make it an excellent investment.

The specific data is subject to PDF, and the above content is for reference

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