| Allicdata Part #: | ATS-17A-198-C3-R0-ND |
| Manufacturer Part#: |
ATS-17A-198-C3-R0 |
| Price: | $ 3.58 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X12MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17A-198-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.25710 |
| 30 +: | $ 3.16932 |
| 50 +: | $ 2.99326 |
| 100 +: | $ 2.81717 |
| 250 +: | $ 2.64109 |
| 500 +: | $ 2.55305 |
| 1000 +: | $ 2.28894 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are being increasingly used in many industries and applications for cooling purposes. ATS-17A-198-C3-R0 is a state-of-the-art thermal-heat sink specifically designed for maximizing airflow in tight spaces. It is an advanced version of the popular series of metal thermal-heat sinks, which focuses on increasing the effective surface area of the sink while minimizing its size. The ATS-17A-198-C3-R0 is an advancement on the metal plate design with its flexible copper shells.
The ATS-17A-198-C3-R0 is designed to provide an efficient way of cooling to small-spaced electronic components. It consists of two parts; the upper plate that makes up the main body and the lower heat dissipation plate. The upper plate of the ATS-17A-198-C3-R0 is composed of copper shells which extend from the back of the main body to the edges. This portion of the thermal-heat sink system is largely responsible for transferring the heat generated by the electronic device into the air flowing around it. The base of the upper plate is also designed with groves and fins to improve the performance of the thermal-heat sink system.
To increase the cooling efficiency, the lower heat dissipation plate uses a series of small fins that are attached to the copper tubes found in the upper plate. These fins are made out of aluminum which provides a greater surface area for the fan to direct heat away from the device. Combined, these two plates create a network of grooves and fins that direct air over the outer surfaces of the device to be cooled. The air absorbs the heat released by the device and is then diverted away to a separate location.
The ATS-17A-198-C3-R0 thermal-heat sink system has been successfully tested in many applications. In these tests, it was found that the sink system had a cooling capacity of up to 70 watts and was able to maintain low temperatures up to 90 degrees Celsius, which is beyond the operational temperature range of many devices. This thermal-heat sink system is designed for use in applications where the ambient temperature is expected to stay below the reference temperature of the device, meaning it is suitable for both indoor and outdoor use. Its compact design also makes it ideal for applications in tight spaces where traditional heat sinks may not fit.
The flexible copper shells of the ATS-17A-198-C3-R0 are specifically designed to provide unparalleled cooling performance. The copper shells are also highly customizable, allowing you to adjust the size and shape of the grooves and fins. This customizable aspect allows for a tailored cooling system to fit the exact requirements of your application. The ATS-17A-198-C3-R0 is an efficient and reliable solution for cooling small-spaced electronic components and is an ideal choice for any system design.
The specific data is subject to PDF, and the above content is for reference