ATS-17A-30-C3-R0

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Thermal heatsinks are used to disperse heat away from a component or object by conducting and radiating it into the surrounding environment. ATS-17A-30-C3-R0 is a type of thermal heat sink that is designed to provide thermal control and manage heat transfer from electronic and electric components. It offers a high quality and reliable solution for a range of different applications where it is essential to effectively dissipate heat energy. With an optimized design, it can provide excellent performance and reliability.

The ATS-17A-30-C3-R0 is a high-performance heat sink that features a low-profile, anodized aluminum alloy construction, providing excellent mechanical strength and durability. The heat sink has an optimized fin design with channels that allow it to be used in confined spaces or tight spaces, and also maximizes the surface area for maximum heat transfer. Additionally, the anodized surface provides excellent corrosion resistance, ensuring a long life and consistent performance.

The core of the ATS-17A-30-C3-R0 is the heat Dissipation fins, which have been designed to provide superior thermal performance. The fins are constructed using a compact and lightweight aluminum alloy with optimal heat transfer characteristics. These fins are designed to be used with standard case fans or an external cooling source, such as a fan, blower or liquid cooling solutions. The versatile fin design allows for easy installation and accommodates a wide variety of applications.

The ATS-17A-30-C3-R0 also offers the advantage of a universal mounting system, allowing it to be used with various types of applications. The heat sink has various mounting holes with various thread sizes to ensure secure and consistent mounting. This ensures a secure connection between the heat sink and the application, eliminating the need for additional brackets or other components. With a effective airflow design, it provides low airflow resistance, further increasing efficiency.

The ATS-17A-30-C3-R0 is an ideal choice for applications that require efficient heat transfer from high power components. It is ideal for use in applications such as telecommunications equipment, automotive electronics, industrial and medical equipment, consumer electronics, and other similar applications. It is also suitable for applications with limited space, such as in servers and other high-density computing environments. The combination of the heat Dissipation fins and sturdy, corrosion-resistant construction make it a suitable choice for many applications.

In summary, the ATS-17A-30-C3-R0 is a high-performance thermal heat sink designed for optimal heat transfer. With its optimized fin design and universal mounting system, it offers a reliable and efficient solution for a variety of applications. With its convenient design and anodized aluminum alloy construction, it provides superior strength and durability, while its low-profile design ensures compatibility with most electronic and electric components.The combination of thermal management features, robust construction, and efficient design make the ATS-17A-30-C3-R0 an ideal choice for many applications requiring efficient heat dissipation.

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