| Allicdata Part #: | ATS-17A-42-C2-R0-ND |
| Manufacturer Part#: |
ATS-17A-42-C2-R0 |
| Price: | $ 7.15 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X22.86MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17A-42-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.43104 |
| 30 +: | $ 6.07383 |
| 50 +: | $ 5.71662 |
| 100 +: | $ 5.35928 |
| 250 +: | $ 5.00200 |
| 500 +: | $ 4.64471 |
| 1000 +: | $ 4.55539 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.900" (22.86mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.31°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-17A-42-C2-R0 is a thermal/heat sink, a common tool designed to disperse heat from devices to other objects through conduction or convection. These are often used as cooling components for computers that are subject to high temperatures, as well as in industrial settings. The ATS-17A-42-C2-R0 is specifically designed to provide effective heat transfer to improve efficiency and performance.
The ATS-17A-42-C2-R0 is designed with a copper base and aluminum fins to help reduce the thermal energy between the heat source and the cooler. The copper base spreads thermal energy to the entire thermal mass of the heat sink while the aluminum fins provide a reasonable compromise between cost and performance for a finished product. This combination of materials and design enables a ATS-17A-42-C2-R0 to dissipate heat faster and more effectively.
The ATS-17A-42-C2-R0 employs a variety of techniques to maximize the rate of heat dissipation. To start, the ATS-17A-42-C2-R0 has a thermal conductivity of 16.7 W/mK, which is greater than that of most copper and aluminum materials and ensures that the heat is conducted away from the device quickly. Additionally, the design of the ATS-17A-42-C2-R0 is optimized for high heat dissipation. The heat sink contains a number of fins that create turbulence in the air flow, allowing the air to move more quickly over the heat sink and dissipate heat more rapidly.
The ATS-17A-42-C2-R0 also utilizes convective cooling to its advantage, meaning that the sink utilizes air movement to transfer heat away from the heat source. It accomplishes this by exploiting the natural convection currents that exist between the hot and cold air. As the air is heated by the heat source, it begins to rise, and the cooler air sinks. This movement of air creates an air flow that takes the heat away from the device and into the environment.
The ATS-17A-42-C2-R0 can also be combined with other cooling components, such as active fans, to further improve the heat dissipation rate. This combination helps to bring air movement rates to levels which are beyond the maximum for natural convection currents, greatly increasing the speed of heat removal.
The ATS-17A-42-C2-R0 provides a wide range of thermal benefits for a variety of applications and is well-suited for both industrial and consumer electronics. It is designed for use with a variety of chipsets, including Intel and AMD processors, as well as for cooling computer components such as memory and hard drives. Furthermore, the ATS-17A-42-C2-R0 is a highly affordable thermal solution that works with a wide variety of systems, making it a great choice for those looking for reliable, efficient, and cost-effective cooling.
The specific data is subject to PDF, and the above content is for reference