| Allicdata Part #: | ATS-17A-55-C3-R0-ND |
| Manufacturer Part#: |
ATS-17A-55-C3-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17A-55-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 24.11°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-17A-55-C3-R0 is a thermal heat sink commonly used in cooling systems for electronic devices. It is a rugged and reliable tool for dissipating heat away from sensitive circuit components. This type of heat sink helps to protect your devices from over-heating, thereby extending the life of the device.
Overview of the ATS-17A-55-C3-R0
This thermal heat sink has an impressive surface area of 17 cm2, making it one of the best heat sinks on the market for dissipating heat. The aluminum fins of the ATS-17A-55-C3-R0 are interlaced and connected with precision-formed ridges. This gives the device a strong, highly efficient, and lightweight design.
In addition, the ATS-17A-55-C3-R0 utilizes high thermal conductivity of aluminum to effectively transfer heat from the source to the heat sink. It also has highly optimized heat dissipating surfaces for maximum cooling efficiency. Moreover, its impressive thermal capacity stands at 1.20w/K.
Application Field of the ATS-17A-55-C3-R0
The ATS-17A-55-C3-R0 is an extremely effective tool for cooling high-powered electronic devices. This thermal heat sink can be used for a variety of industrial applications, such as cooling high-powered transistors or microprocessors in industrial automation systems, communications networks, power plants, and heavy industry. It can also be used to cool high-end personal computers, gaming consoles, and servers.
Moreover, the ATS-17A-55-C3-R0 is an ideal cooling solution for cooling medical and scientific instruments, including electron microscopes and imaging devices. This thermal heat sink is also often used to cool down large-scale data centers and server farms.
Working Principle of the ATS-17A-55-C3-R0
The ATS-17A-55-C3-R0 works on a simple principle of convective heat transfer. The aluminum fins of the device act as a medium to dissipate heat away from a source. When a heat source is placed in contact with the device, the aluminum fins absorb the heat and transfer it away from the source and out into the surrounding environment. The device is highly efficient at this process due to its optimized fin design and its large surface area.
The ATS-17A-55-C3-R0 is also equipped with an integrated Pertronic thermal conductive thermistor. This thermistor allows the device to detect the temperature of the source and then automatically adjusts the speed of the fan to ensure maximum cooling efficiency. The thermistor also monitors the internal temperature of the device and will shut down the fan if necessary, to avoid overheating.
Conclusion
The ATS-17A-55-C3-R0 is an excellent choice for cooling a variety of electronic devices. Its large surface area and high thermal efficiency make it an ideal cooling solution for industrial applications, while its integrated Pertronic thermistor allows the device to automatically adjust its fan speed for maximum cooling efficiency. The ATS-17A-55-C3-R0 is a reliable and robust thermal heat sink and is perfect for protecting your devices from unwanted and potentially damaging heat build up.
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