| Allicdata Part #: | ATS-17A-72-C3-R0-ND |
| Manufacturer Part#: |
ATS-17A-72-C3-R0 |
| Price: | $ 5.15 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17A-72-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.63806 |
| 30 +: | $ 4.38060 |
| 50 +: | $ 4.12297 |
| 100 +: | $ 3.86524 |
| 250 +: | $ 3.60755 |
| 500 +: | $ 3.34987 |
| 1000 +: | $ 3.28546 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.19°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-17A-72-C3-R0 is a high performance thermal heat sink designed to facilitate the cooling of electronic components, such as microprocessors, LEDs, or any other component requiring heat dissipation. Heat dissipation is an important factor in ensuring electronic components enjoy a long service life, as reducing the temperature of these components helps protect them from being damaged by thermal shock or over-heating. This thermal heat sink is designed to mount through the board, onto the component, and can be adjusted to ensure an optimal fit.
The ATS-17A-72-C3-R0 contains five different pieces, including the base plate, the mounting bracket, the radiating fan, the clip and the thread tubes.
The base plate is made from a special aluminum alloy, which not only provides excellent thermal conductivity, but also gives the heat sink strength and rigidity. This aluminum alloy is used in the construction of a light-weight, durable and cost effective base plate.
The mounting bracket is just as strong and resilient as the base plate, and is designed to fit over the component in order to secure the device in place. It is made of stainless steel, and is designed to hold up to the rigors of repeated use. This bracket also includes a sliding ratchet that helps it adjust to different types of components.
The radiating fan is designed to spin, drawing in the heat generated by the component, transferring it to the base plate, and then emitting it out into the surrounding area. This fan rotates at a safe speed of 2500rpm, and contains a set of fan blades which ensures efficient airflow. It also contains an over-heat protection (OHP) switch, which cuts off the power supply to the fan if it starts to run too hot. This switch will prevent the fan from over-heating the component and damaging it.
The clip is designed to secure the component in place, preventing it from vibrating or loosening from the base plate. This clip also helps to keep the components aerodynamically stable, as air is drawn and expelled by the fan more efficiently.
The thread tubes connect the base plate to the mounting bracket. These tubes are made from stainless steel and are designed to be resilient and strong. The thread tubes offer incredible strength and durability, withstanding temperatures of up to 650 degrees Celsius.
The ATS-17A-72-C3-R0 thermal heat sink is designed to be used in a variety of circumstances, such as laptop computers, LED displays, industrial machinery, and data centers. The cooling performance offered by the ATS-17A-72-C3-R0 makes it an ideal choice for areas where space is at a premium, ensuring reliable operation at all times. It is safe for use in both air-cooled and liquid-cooled systems.
The operation of the ATS-17A-72-C3-R0 is simple, as it relies on the circulation of air to transfer the heat from the component to the base plate. The aluminum alloy base plate absorbs the heat from the component, dissipating it outwards and allowing the fan to draw the heated air away from the component. This process helps keep electronic components running at a safe temperature, ensuring their reliable operation and long service life.
The specific data is subject to PDF, and the above content is for reference