ATS-17A-73-C1-R0 Fans, Thermal Management |
|
| Allicdata Part #: | ATS-17A-73-C1-R0-ND |
| Manufacturer Part#: |
ATS-17A-73-C1-R0 |
| Price: | $ 3.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17A-73-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
。Thermal - Heat Sinks
Being able to effectively dissipate heat from a system can be one of the main determinants of its performance and longevity. Heat sinks are designed for this purpose, and the ATS-17A-73-C1-R0 is one such product that can provide an effective solution for thermal management.
Application Field
The ATS-17A-73-C1-R0 is a heat sink specifically designed to enable heat dissipation from circuit boards and other electronic devices. It makes use of an Aluminium alloy material with a wide assortment of fin profiles for optimal cool air flow, helping to accelerate the transfer of heat from the hot surface to the environment more quickly. It also comes with side walls and a base for mounting adaptors, connectors and other components to be easily attached to your electronic device. This makes it highly suitable for applications such as refrigerators, air conditioners, computers and servers, and other appliances.
Working Principle
The working principle behind the ATS-17A-73-C1-R0 is simple. The dimensions of the fin profile used in this heat sink design are intended to maximize air-cooled performance by providing greater surface area for better heat transfer. The fins are cut to create a ‘ripple effect’ throughout the heat sink, which further increases the total effective cooling area. This ripple is then used to draw in air from the surrounding area due to convection, allowing it to capture more heat and dissipate it more efficiently, ultimately helping to reduce the temperature of the targeted system.
In addition to the ripple fin design, the ATS-17A-73-C1-R0 also takes advantage of the aluminum alloy material it is made from. Aluminum alloys possess excellent thermal properties, which make them perfect for heat dissipation. These thermal properties also make aluminum alloy well-suited for low-weight and low-volume applications, making it an ideal choice for designing sleek, low-profile cooling solutions.
Conclusion
The ATS-17A-73-C1-R0 is an excellent heat sink specifically designed to provide effective heat dissipation from circuit boards or other electronic devices. It makes use of an aluminum alloy material with a wide array of fin profiles for maximum air-cooled performance. Its ripple fin design helps to further enhance the total effective cooling area, while the aluminum alloy material provides low-weight and low-volume applications. All these features combine to make the ATS-17A-73-C1-R0 a great choice for cooling systems in home or industrial applications.
The specific data is subject to PDF, and the above content is for reference