| Allicdata Part #: | ATS-17B-02-C3-R0-ND |
| Manufacturer Part#: |
ATS-17B-02-C3-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17B-02-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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.Thermal management plays an important role in the electronics industry, including the application of heat sinks to dissipate the heat generated by various electronic components. The ATS-17B-02-C3-R0 is a heat sink designed to provide cooling for high performance applications.
The ATS-17B-02-C3-R0 is an eccentrically mounted heat sink designed to cool sensitive electronic components, particularly those used in telecom applications. The unit features an extended fin cross-section to increase transfer of heat from the device while minimizing the size of the heat sink. The unique features of the ATS-17B-02-C3-R0 include a die cast aluminum housing, an extended fin design, a unique thermally optimized heat dissipation structure, and an adjustable thermal mount assembly.The ATS-17B-02-C3-R0 heat sink is designed for use in a variety of applications. It is well suited for applications involving power transistors, RF transistors, MOSFETs, or ICs that require effective cooling. The heat sink can also be used in conjunction with air and water-cooled systems for applications requiring dissipating heat generated by rectifiers, inverters, and DC-DC converters. In addition, the ATS-17B-02-C3-R0 heat sink can be used in association with AC and DC powered audio amplifiers to dissipate the heat generated by the transistors and other components.
The ATS-17B-02-C3-R0 heat sink is designed to work in conjunction with forced air, either natural or forced-air convection cooling systems. It features a unique thermally optimized design that ensures efficient cooling with minimal power consumption. The heat sink includes a die-cast aluminum housing, a thermally optimized extended-fin design, a unique mounting system, and adjustable thermal mount assembly. The heat sink is also designed for easy installation and can be installed into any cylindrical, rectilinear, or cylindrical-rectilinear enclosure with minimal effort.
The ATS-17B-02-C3-R0 is designed using a combination of innovative design features and patented technologies. The unique thermally optimized structure ensures proper heat transfer from the heat source to the fins for superior cooling. Moreover, the adjustable thermal mount assembly allows the user to fine-tune the thermal performance by adjusting the contact pressure between the IC and the heatsink. This helps optimize the thermal performance while also minimizing unnecessary system stress.
The ATS-17B-02-C3-R0 is an ideal thermal solution for high performance applications. It provides superior cooling with minimal power consumption, is designed for easy installation, and can be used in a variety of applications. In addition, the adjustable thermal mount assembly allows users to fine tune the thermal performance of the system for optimal performance.
The specific data is subject to PDF, and the above content is for reference